Lam Research 810-068158-014 PCBA CIRCUIT BOARD

810: Equipment platform prefix, corresponding to a specific series of Lam Research’s process equipment (e.g., a generation of etching machines or thin-film deposition equipment), indicating the core range of equipment models that this PCBA is compatible with.

068158: Function code, corresponding to the PCBA’s specific functional module (e.g., "RF power control sub-board", "vacuum system signal conditioning board", or "wafer transfer logic control board"). The exact function must be confirmed in conjunction with the equipment subsystem; Lam Research has not fully disclosed a universal coding dictionary, so reference to the equipment manual is required.

014: Version number (Revision 14), representing the hardware iteration version of this PCBA. Subsequent versions (e.g., 015, 016) may optimize component selection, circuit layout, or compatibility, and are generally backward-compatible with previous-generation equipment.

Etching equipment (e.g., plasma etching machines): May be responsible for RF (radio frequency) power regulation signal processing and plasma parameter monitoring signal amplification.

Deposition equipment (e.g., Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD) systems): May manage reaction chamber pressure control logic and gas flow valve drive signal output.

Wafer transfer systems: May participate in signal processing for wafer robot arm position calibration and monitoring/feedback control of vacuum adsorption status.

Analog signal processing: Amplifies (with adjustable gain) and filters (to remove high-frequency noise) weak analog signals (e.g., mV-level voltages) output by pressure sensors, temperature sensors, and flow sensors, converting them into standard signals (0-10V/4-20mA) recognizable by the equipment’s main controller to ensure the accuracy of process parameter monitoring.

Digital signal interaction: Communicates with the equipment’s main CPU via serial communication interfaces such as SPI, I2C, and UART, transmitting control commands (e.g., "adjust valve opening", "start sensor calibration") and status feedback data (e.g., "current module temperature", "signal link integrity"). The communication delay is ≤ 1ms, meeting real-time control requirements.

Power output: Converts low-voltage control signals into high-voltage/high-current drive signals (e.g., 24V/5A) via power MOSFETs or IGBT driver chips to drive actuator operations.

Safety protection: Built-in overcurrent protection (OCP), overvoltage protection (OVP), and overtemperature protection (OTP) circuits. When excessive output current, abnormal power supply voltage, or excessive PCB temperature (e.g., ＞90℃) is detected, it automatically cuts off power output and sends a fault signal to the upper-level controller to prevent component burnout or equipment damage.

Component selection: All components are industrial-grade or military-grade, with a temperature range of -40~125℃ and a component lifespan of ≥ 100,000 hours (MTBF, Mean Time Between Failures).

Redundancy design: Key signal links (e.g., sensor inputs, power outputs) adopt dual-channel redundancy. If one channel fails, it automatically switches to the backup channel to avoid equipment shutdown due to a single point of failure.

Heat dissipation optimization: The PCB uses high-thermal-conductivity copper-clad material, and heat dissipation vias are designed under key power components. Combined with the internal heat dissipation air duct of the equipment, the operating temperature of components is controlled to ≤ 70℃ (typical value).

Etching equipment: Kiyo? series plasma etching machines, Syndion? series metal etching machines;

Deposition equipment: Endura? series Physical Vapor Deposition (PVD) equipment, Victory? series Chemical Vapor Deposition (CVD) equipment;

Others: Core control subsystems of wafer cleaning equipment and thin-film measurement equipment (specific compatibility must be confirmed via Lam Research’s equipment model and spare parts list).

Replacement prerequisites: Must be operated by Lam Research-certified engineers. Before replacement, the power supply to the corresponding subsystem of the equipment must be cut off to avoid component damage caused by hot-swapping.

Calibration requirements: After replacement, the signal accuracy and power output of the PCBA must be calibrated using Lam Research’s dedicated calibration software (e.g., Lam Equipment Calibration Tool) to ensure compatibility with the equipment’s main system. The calibration cycle is typically once a year (or every 1,000 hours of operation).

Spare part management: As a critical spare part for semiconductor equipment, it must be stored in a clean, dry environment (temperature 20-25℃, humidity 30%-60%) to avoid electrostatic damage (it should be placed in an anti-static packaging bag during storage).