- Shenzhen Chaosheng Electronic Technology Co., Ltd.
-
1YrShenzhen, Guangdong, China - Main products: Oversized PCB, Any order HDIPCB, High frequency hybrid HDIPCB, Special material PCB
Home > Products > Oversized Circuit Board (PCB) > 2-layer thick copper ultra large size circuit board PCB,
2-layer thick copper ultra large size circuit board PCB,
- Huanggang Port, Shenzhen
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- 25 days
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Product Details
| Material | Fiberglass Epoxy | Type | Rigid Circuit Board | |
| Application | Aerospace | Brand | China Chaosheng Electronic PCB | |
| Flame Retardant Properties | V0 | Dielectric | FR-4 | |
| Insulation Materials | Organic Resin | Processing Technology | Electrolytic Foil | |
| Mechanical Rigid | Rigid | Base Material | Aluminum | |
| Transport Package | Vacuum packaging+white paper insulation+moisture-proof beads+tin vacuum packaging+cardboard box | Specification | 902 * 902mm/1 * 1pcs | |
| Origin | Shenzhen, Guangdong, China |
Product Description
Introduction to the entire production process of Chaosheng printed circuit board
Product areas: LED lights, high-power equipment
Layers: 2 layers of ultra large thick copper circuit board PCB
Board thickness: 3.0mm
Size: 1100 * 1100mm/1 * 1pcs
Process structure: Copper thickness of 175um+OSP
Voltage withstand test: 100% short circuit test
The minimum mechanical hole is 0.35mm, laser hole/mm
Minimum line width and spacing 10/10 mil
Surface treatment: OSP "+, solder mask free
Feature: High current effect
Usage: Large equipment, large electric furnaces and other products
Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity
metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex
step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNi
LED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-
free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board,
blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based,
PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resis
tance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-
frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board,
HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard com
bination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development,
software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight
sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intellig
ent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments,
SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music
equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation,
military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, autom
otive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna
cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles,
automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment,
backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace,
national defense and other product fields.
| Process Capability Table | ||||
| Technical ltem | MassProduct | Advanced Technology | ||
| 2015 | 2021 | 2025 | ||
| Max.Layer Count | 80 layer | 100 layer | 100 layer | |
PCB through hole board | 2～80 layer | 2～100 layer | 2～100 layer | |
Maximum size through hole 1～2 | 37〞*98.50" | 43.3〞*118.11" | 43.3〞*118.11" | |
Minimum line width and spacing | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum mechanical hole(mm) | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
Maximum size through hole 4～22 layers | 37〞*43.30" | 43.3〞*43.30" | 43.3〞*43.30" | |
Maximum size through hole 4～22 layers | 31.50 ″*59" | 31.50 ″*70.86" | 31.50 ″*70.86" | |
Maximum size through hole 4～22 layers | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum line width and spacing for multi-layer large-sized PCBs | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
| Maximum size HDI 4～36 layers | 31.50 ″*55" | 31.50 ″*55" | 31.50 ″*55" | |
| Minimum line width and line spacing of large size PCB | Through hole 12 / 12milHDI14 /14mil | Through hole 10/10 milHDI12 / 12mil | Through hole 8 / 8milHDI12 / 12mil | |
| The largest board ruler 1 → the smallest hole of 18 layers | Through hole 0.50mmHDI :0.45mm | Through hole 0.50mm HDI : 0.45mm | Through hole 0.50mmHDI : 0.45mm | |
| The layer number of FPC | 1～36layer | 1～60layer | 1～60layer | |
| Maximum size of flexible FPC | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
| Maximum size of flexible FPC with soft hard combination | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
FPC (roll to roll) maximum size | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
Maximum size of FPC single chip shipment | 19.68 ″*118.11" | 19.68 ″*196.8" | 19.68 ″*196.80" | |
| The layer number of FPC | 2～18 layer | 2～36 layer | 2～42 layer | |
Maximum size of layered board | 19.68 ″*35" | 19.68 ″*43" | 19.68 ″*43" | |
Number of through-hole layers | 2～20layer | 2～30 layer | 2～40 layer | |
Hard and soft HDI layers | 2～14 layer | 2～18 layer | 2～22 layer | |
Maximum size of soft and hard combination | 19.68 ″*43" | 19.68 ″*49" | 19.68 ″*49" | |
FPC/soft-hard combination arbitrary interconnection HDI | 4+X+4Interconnect HDI | 5+X+5Interconnect HDI | 6+X+6Interconnect HDI | |
HDIPCB layers | 4～36layer | 4～60layer | 4～80 layer | |
Anylayer HDI PCB | 4+X+4Interconnect HDI | 5+X+5、Interconnect HDI | 8+X+8、Interconnect HDI | |
HDIPCB maximum board size | 24"*52" | 43"*49" | 43"*49" | |
Number of through hole layers of high frequency board | 2～18 layer | 2～36 layer | 2～60 layer | |
| HDI layers ofhighfrequency board | 2～16 layer | 2～24 layer | 2～60layer | |
| Maximum size of high frequency board | 37 ″*43" | 43 ″*49" | 43 ″*49" | |
Number of ceramic plates | 1-2 layer | 1～4 layer | 1～6 layer | |
Ceramic plate thickness | 0.60mm-1.60mm | 0.38mm-20.0mm | 0.38mm-20.0mm | |
Maximum size of ceramic plate | 100*150mm | 150*190mm | 150*650mm | |
Minimum aperture of ceramic plate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of ceramic board | 16/16mil | 12/12mil | 10/10mil | |
Number of layers of metal copper substrate | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum line width and line spacing of metal iron substrate | 12/12mil | 4/4mil | 4/4mil | |
Number of layers of metal aluminum substrateHDI | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum size of metal substrate | 37 ″*43" | 25.59 ″*59" | 25.59 ″*59" | |
| The smallest hole of the metal substrate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of metal substrate | 8/8mil | 4/4mil | 4/4mil | |
| Transparent FR- 4 material layers | 1-2layer | 1-2layer | 1-8layer | |
| Transparent FR-4 minimum hole | 0.35mm | 0.35mm | 0.35mm | |
| Transparent FR-4 minimum line width and spacing | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| Transparent FR- 4 maximum size | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of tempered glass base layers | 1-2layer | 1-2layer | 1-2layer | |
| Minimum line width and spacing of glass | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| The smallest hole in glass | 0.35mm | 0.35mm | 0.35mm | |
| Maximum size of glass | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of layers of transparent PETmaterial | 1-2layer | 1-2layer | 1-2layer | |
| Maximum size of transparent PET | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
The company's main product types | Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、 High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc | |||
| Main material | Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc | |||
Main material categories | Halogen-free、halogenated、 high thermal conductivity, high TG135 、TG140、 TG150、 TG170、TG180、TG240、TG320 | |||
| Build-up Material | FR-4 ，TG150,TG70,TG180 | |||
| Conventional plate thickness (mm) | Min.1-2L(mm) | 0.10mm | 0.10-12.0mm | 0.10-18.0mm |
| Min.4-10L(mm) | 0.35mm | 0.35mm～10.0mm | 0.35-18.0mm | |
| Min.12L(mm) | 0.43 | 0.38～10.0mm | 0.38～18.0mm | |
| Min.16L(mm) | 0.53 | 0.45～10.0mm | 0.45～18.0mm | |
| Min.18L(mm) | 0.63 | 0.51～10.0mm | 0.51～18.0mm | |
| Min.52L(mm) | 0.8 | 0.65～10.0mm | 0.65～18.0mm | |
| MAX(mm) | 3.5 | 12.0mm | 18.0mm | |
Copper plate thickness and copper thickness | 1-2 layerCU | 700um | 875um | 875um |
| Layers 4-20 | 4-12layer | 4-16layer | 4-22layer | |
| Inner layer copper thickness（um) | 875um | 1050um | 1225um | |
Outercopperthickness | 210um | 350um | 525um | |
Thick copper finished plate thickness | 8.0mm | 12.0mm | 18.0mm | |
| IC substrate | layerHDI | 1-10layer | 1-14layer | 1-16layer |
| Line width and spacing | 50um | 25um | 15um | |
| copper thickness | 8-10um | 10-12um | 12-15um | |
| Min.CoreThickness um(mil) | 254" (10.0) | 0.15～254(10.0mm) | 0.15～254(10.0mm) | |
| Min.Build up Dielectric | 38(1.5) | 25(1.0) | 25(1.0) | |
BaseCopperWeigh t | Inner Layer | 1/4-8 OZ | 1/4-0.30mm | 1/4-0.30mm |
| Out Layer | 1/4-10 OZ | 1/4-30 OZ | 1/4-30 OZ | |
| Gold thick | 1～40u" | 1～200u" | 1～200u" | |
| Nithick | 76～127u" | 1～250u" | 1～250u" | |
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
Min. IVH、Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | |
| 125(5) | 125(5) | 125(5) | ||
| SKipvia | Yes | Yes | Yes | |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
| Technicalltem | MassProduct | Advanced Technology | ||
| Hole depth/diameter | Through Hoie | 25:01 :00 | 35:01 :00 | 40:01 :00 |
| AspctRatio | MicroVia | 0.8 :1 | 0.8 :1 | 0.8 :1 |
| copperFilling Dimple Size | 10(0.40) | 5(0.20) | 5(0.20) | |
Minimumouter line width/ spacing | Inner layer line width and spacing | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
PlatedLayerum(mil) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |
| BGAPitchmm(mil) | 0.4 | 0.4 | 0.4 | |
| PHMin.Hole rlng um(mil) | 75(3) | 62.50(2.50 | 62.50(2.50 | |
| Line Width control | <2.5mil(mil) | ±0.50 | ±0.50 | ±0.50 |
| 2.5mil≤L/W<4mil | ±0.50 | ±0.50 | ±0.50 | |
| ≤3mil(mil) | ±0.60 | ±0.60 | ±0.60 | |
| SolderMask Registration um(mil) | ±25 | ±25 | ±25 | |
| Solder masThickness | Lines Minum(mil) | 10(0.40) | 10(0.40) | 10(0.40) |
| Lines Minum(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| CopperMinum(mil) | 10(0.40) | 10(0.40) | 10(0.40) | |
| CopperMax um(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| Mln.Solder Mask opening um(mil) | 250(10) | 200(8) | 200(8) | |
Structure | Stacking layer by layer | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 42Any Layer | 46Any Layer | 60Any Layer | |
| Stacking layer by layer | N+N | N+N | N+N | |
| N+X+N | N+X+N | N+X+N | ||
| Sequenetlal Lamination | 4+(N+X+N)+4 | 5+(N+X+N)+5 | 6+(N+X+N)+6 | |
Multi-layer stepped structure | Multi- layer stacking | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 12Any Layer | 16Any Layer | 18Any Layer | |
| Multi- layer staircase | 4 steps | 6 steps | 6 steps | |
| Mechanical depth control drilling depth | 2.0mm±0.08mm | 2.0mm±0.08m | 2.0mm±0.08m | |
| Laser controlled depth drilling | 0.6mm±0.08mm | 0.8mm±0.08mm | 1.0mm±0.08mm | |
/Min.HOle/Land um(mil) | linner um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Outer um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Minimumburiedholediameter/solder pad | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
| SUBDielectricThic kness | Mln.um(mil) | 38(1.5) | 32(1.3) | 25(1.0) |
| Max.um(mil) | 125(5) | 125(5) | 125(5) | |
| SKipvia | Yes | Yes | Yes | |
| Via on hole(LaserViaon BuriePTH | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
Resin plug hole plate thickness | Min mm(mil) | 0.35 | 0.35 | 0.35 |
| Max mm(mil) | 3.2 | 3.2 | 3.2 | |
| Min mm(mil) | 125(5) | 110(4.50) | 110(4.50) | |
| Routing Depth control Accuracy um(mil) | ±50um(mil) | ±50um(mil) | ±50um(mil) | |
| Outine NC Rcuting Tolerance um(mil) | 75(3) | 75(3) | 75(3) | |
Type of surface Finishing | OSP、 Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers | |||
| EN Thickness Control(um) | >0.025-0.1um | >0.025-0.1um | >0.025-0.1um | |
| OSOSP Thickness(um) | >0.20-0.50um | >0.20-0.50um | >0.20-0.50um | |
| Ni Thickness(um) | >105? 250um | >105? 250um | >105? 250um | |
| Platinum thickness control | >0.025-5um | >0.025-5um | >0.025-5um | |
| Lead/lead- free tin spraying thickness | >105? 150um | >105? 150um | >105? 150um | |
| Electrosilver | >105? 140um | >105? 140um | >105? 140um | |
| Thickness control of sinking silver | >105? 140um | >105? 140um | >105? 140um | |
| Tin thickness control | >105? 140um | >105? 140um | >105? 140um | |
Min TestPAD | E/Tum(mil) | 75(3) | 75(3) | 75(3) |
| E/Tum(mil) | 50(2) | 50(2) | 50(2) | |
| E/Tum(mil | 25(1) | 25(1) | 25(1) | |
| E/Tum(mil) | 150（6） | 150（6） | 150（6） | |
lmpedanceContro lTolerance | ≧50ohm | ± 10% | ±8% | ±8% |
| ≦50ohm | ±50ohm | ±50ohm | ±50ohm | |
| Finished board | Plate thickness≧0.15mm | ≧ ± 10% | ≧ ± 10% | ≧ ± 10% |
| Plate thickness≧0.15mm | ≧ ±0.075% | ≧ ±0.075% | ≧ ±0.075% | |
| Warpage | ≤0.7% | ≤0.5% | ≤0.5% | |
| The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide! | ||||
FAQ
Question Point Answer
Q: What information is required for PCB
CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface
treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products,
copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product
application fields, and other related information are required
Q: What information does PCBA need to provide
CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y
coordinate numbers of PCBA components, and processing requirements:
Do we need to purchase the components
on our behalf?
Or customer supplied components?
Do you need software burning?
What is the required quantity?
What is the monthly demand and other detailed information.
Question: Is my file secure?
CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire
process. All files provided by the customer will never be shared with any third party.
Q: What is the minimum order quantity?
CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.
Q: Do you have any other services?
CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In
addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And
product design, product development, software development
Q: What is your inspection method? How do you control the quality?
CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and
small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product
undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully
automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI),
BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software
burning undergo 100% full testing through finished product testing rack according to product functional requiremen
ts.
Company Profile
Company Profile The development history of Chaosheng Group shows a typical trajectory from its establishment to growth into a leader in the printed circuit board industry. A brief overview of Chaosheng Group, its subsidiaries, and specialty products: History and Background of Chaosheng Company: Chaosheng Group was founded in 1968, originating from Japan, under the name Chaosheng Technology Japan Kawasaki Co., Ltd. In 2012, the company implemented a shareholding reform, marking a shift towards more modern and standardized management. As a Sino Japanese Hong Kong joint venture, Chaosheng Group holds an important position in the Chinese circuit board manufacturing industry. Global factory distribution Zhejiang Kunying Electronic Technology Co., Ltd. (formerly renamed after the merger of Taiwan Kunying Electronics) was established in 2001, increasing the production and technical capabilities of Chaosheng Group in the field of circuit boards. Mainly focusing on high-end precision flexible circuit boards. Shenzhen Chaosheng Electronic Technology Co., Ltd. and Shenzhen Guangrui New Electronics Co., Ltd. (formerly known as Shenzhen Mingze Electronics Co., Ltd.) were established in 1993 and 2008 respectively, further expanding Chaosheng Group's layout in the Chinese market. We mainly provide supporting processing factories for customers in product design, software development, product research and development, and SMT surface mount processing. Chaosheng Group has multiple sales networks worldwide, covering France, the United Kingdom, Germany, Japan, Europe, Switzerland, Africa, North America, Austria, Taiwan, Hong Kong and other countries and regions, showcasing its global influence. Product Features and Applications: Widely used products: communication equipment, communication instruments, optical communication, infinite terminals, new energy, intelligent systems, medical devices, detection systems, aviation, aerospace, military, drones, robots, AI technology, 5G equipment, 5G communication, optical products, LED、 The high-tech fields such as communication, automotive, and home electronics reflect the technological strength and market insight of Chaosheng Group. Main materials: halogen-free materials FR-4， Polyimide PI materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR-4 materials, heat dissipation materials, embedded materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, etc. Product structure: Metal based mixed pressure plate, embedded copper, buried resistance, buried capacitance, buried ceramic bead plate, buried ceramic, ceramic mixed pressure, multi-layer ceramic, BT board, ultra thick PCB, multi-layer aluminum substrate, high-frequency mixed pressure, impedance board, thick copper plate, thick gold plated board, high and low copper, high carbon resistance, transparent FR-4 multi-layer, glass plate Anylayer、 Single, double, multi-layer, soft and hard combination HDI, roll to roll FPC, ultra long and ultra large size boards, PCB production and product design and development, software development and SMT, PCBA and other integrated production factories The annual output value of Chaosheng Group exceeds 100 billion yuan, with the annual output value of printed circuit boards reaching over 65 billion yuan, demonstrating its strong production capacity and market competitiveness. With the continuous advancement of technology and changes in the market, Chaosheng Group needs to continue to pay attention to the dynamics of new technologies, products, and markets, strengthen research and development investment and innovation capabilities, in order to maintain its competitive advantage and industry position.
Contact Us
- Shenzhen Chaosheng Electronic Technology Co., Ltd.
- Contact nameMank.Li Chat Now
- Phone86-0755-89586738
- AddressAilian community shigangxu rd industrial zone, Shenzhen, Guangdong
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