12 layers of flexible multi-layer,soft hard combined FPC,Mobile phone motherboard, touch screen

Product field: Fingerprint product series;Mobile phone motherboard, touch screen

Layers: 12L FPC

Plate thickness 0.35mm ± 10%; 

Size: 125 * 25mm/1*12

Process structure: DuPont PI, minimum hole 0.200mm, copper thickness 1OZ, line width and spacing 3/3mil

Surface treatment: Electric gold 1u"

Main Product Structure of Chaosheng Group Company

2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production

Chaosheng Group Company mainly produces product categories

High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.

The main application areas of PCB and PCBA products of Chaosheng Group Company

Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;

The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company

Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.

Serial Number Project Manufacturing capability

1 Layers Floors 1-80

2 Maximum size of PCB 2500*1150mm

3 Maximum size of flexible FPC 500mm*100m

4 Maximum size of PCBA 1600mm*1000mm

5 FPCBA maximum size 500mm*100m

6 PCB finished product thickness 0.15-12.0mm

7 Thickness of flexible FPC finished product 0.05-0.60mm

8 Finished copper thickness 12um-1075um

9 Minimum finished aperture of laser hole 0.075mm

10 Minimum line width and spacing 1.5mi/1.50mil

11 Minimum finished hole diameter for through-hole 0.15mm

12 Thickness stacking aspect ratio 1:35

13 By processing methods VIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc

14 Surface Treatment Sinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver

15 Main substrate brands Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui/Mitsui Top), Taiyo TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hongren Hongren, Xin Yang, Nippon Steel Nippon Stee, Teflon, Yasen, Matsushita, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (USA) 3M Location, Kyocera CERADIR, Jiuhe, Jiuhao, China Porcelain, Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin, Bergs, Yalong, Taiconieta, etc

16 Solder mask color Green, black, red, yellow, white, blue, purple, matte green, matte black, etc

17 Test service AOI、X-Ray、 Voltage withstand test, short circuit test, soldering test, thermal shock test, functional test, high temperature and high humidity test, first piece tester, etc

18 Molding method CNC shape, punch shape, V-CUT+forming method

19 Finished product warpage ≤0.5%

20 Mechanical aperture tolerance ≤0.025mm

21 Finished product warpage ≤0.5%

22 MiNiLED Minimum PAD 0.065mm/0.065mm

23 Thermal conductivity ≧8W

24 Highest withstand voltage 2500Pa

25 High carbon resistance value and tolerance ≧100→15000Ω±20%

26 Impedance tolerance ≤5→8%Ω

27 IC Carrier Board Series Minimum line width and spacing of 20um/20um

FAQ

Question Point Answer

Q: What information is required for PCB CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required

Q: What information does PCBA need to provide CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.

Question: Is my file secure? CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.

Q: What is the minimum order quantity? CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.

Q: Do you have any other services? CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development

Q: What is your inspection method? How do you control the quality? CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.