6L flexible FPC second order

Product field: Camera products

Layer number: 6L flexible FPC second order

Plate thickness: 0.350mm

Size: 142 * 106.0mm/1 * 1 piece

Process structure: PI, copper thickness 1OZ, covering film

The minimum mechanical hole is 0.35mm,

Laser hole 0.076mm

Minimum line width and spacing of 5/5ml

Surface treatment: Sinking gold 1u“

The main product structure of Ultrasonic Group

2-80-layer rigid circuit board, 2-50-layer flexible circuit board and PCBA production

Ultrasonic Group's main product categories

High-end double-sided, multi-layer, flexible, high-frequency, HDI interconnection, metal-based, high-thermal conduction metal-based, ceramic, metal cutting, buried capacitor cutting, thick copper buried magnetic cutting, convex and concave stepping substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiniLED, MiniHDILED, MiniOLED, IC carrier board substrate, roll-to-roll FPC, long FPC, large printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind hole buried circuit board, high thermal conductivity aluminum base, thermoelectric separation copper base, PDU busbar, iron-based and metal-based (core) hybrid pressure plate, embedded copper buried copper. Buried resistor buried capacitor buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper board, thick gold-plated board, HDI full-layer interconnected OEM and ODM production factories, suitable for multi-layer, double-sided, Anylayer, HDI FPC, soft-hard-combined HDI, roll-to-roll FPC, ultra-long FPC, ultra-large-size PCB production and product design and development, software development, special material printed circuit board, etc. Roll-to-roll FPC, ultra-long FPC, ultra-large-size PCB production and product design and development, software development, special material printed circuit boards, etc. Roll-to-roll FPC, ultra-long FPC, ultra-large-size PCB production and product design and development, software development, special material printed circuit boards, etc.

The main application areas of the PCB and PCBA products of Chaosheng Group

Communication terminals, communication stations, electronic communications, optical fibers, optical modules, backlights, chip systems, communication equipment, communication instruments, computers, intelligent equipment, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power, industrial power, communication power, automotive power, office equipment, digital products, computers and other application fields;

The main application areas of flexible circuit board (FPC) and FPCA products of Chaosheng Group Co., Ltd.

Hard disks, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, intercom antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical equipment, instruments, drives, automobiles, automotive instruments, automobile drive disks, drives, optical drives, medical equipment, medical equipment, backlights, modules, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, national defense and other product fields.

Serial number project Manufacturing capability

1 layer Floor 1-80

2 Maximum size of PCB 2500*1150 mm

3 Maximum size of flexible FPC 500mm*100m

4 Maximum size of PCBA 1600mm*1000mm

5 FPCBA Maximum Size 500mm*100m

6 PCB finished product thickness 0.15-12.0 mm

7 Flexible FPC finished product thickness 0.05-0.60 mm

8 Finished copper thickness 12 microns-1075 microns

9 Minimum completion aperture of laser hole 0.075 mm

10 Minimum line width and spacing 1.5mi/1.50 million

11 Minimum completion aperture of through hole 0.15 mm

12 Thickness stacking aspect ratio 1:35

13 Through the processing method VIA blind and buried hole treatment: ink plug holes, resin plug holes, copper paste plug holes, VCP copper filled holes, silver paste plug holes, carbon oil plug holes, etc.

14 Surface treatment Gold-sinking, nickel-plated gold, thick gold electroplating, gold-plated + OSP, nickel-plated gold + gold-sinking, nickel-plated gold + gold-sinking + OSP, gold-plated + OSP, gold-plated + gold-plated gold-plated, gold-plated + gold-plated, gold-plated, gold-plated, gold-plated, gold-plated, gold-plated, gold-plated, gold-plated

15 Main substrate brands Rogers, Aaron, Taconico, TP-2, Megtrotron, Necklow, Esora, F4B, 3M, Mitsui Group (Japan Mitsui/Misi Top), Sun TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hirohito Hirohito, Shinyang, Japan Steel Nippon Stee, Teflon, Yason, Panasonic, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (US) 3M Location, Kyocera CERADIR, Jiuhe, No.9, Chinese Porcelain, Huaqing, Ason, Slitton, Kaichangde, Communications, Bergs, Yalong, Taiconita, etc.

sixteen Solder resist color Green, black, red, yellow, white, blue, purple, matte green, matte black, etc.

17 Testing Services AOI, X-ray, pressure withstand voltage test, short circuit test, welding test, thermal shock test, functional test, high temperature and high humidity test, first-piece tester, etc.

18 Forming method CNC shape, punch shape, V-CUT+ molding method

nineteen Finished warping ≤0.5%

20 Mechanical hole tolerance ≤0.025 mm

21 Finished warping ≤0.5%

22 MiNiLED Minimum Soldering Pad 0.065mm/0.065mm

23 Thermal conductivity ≧8W

24 Maximum withstand voltage 2500 Pa

25 High carbon resistance value and tolerance ≧100→15000Ω±20%

26 Impedance tolerance ≤5 → 8%ω

27 IC carrier series Minimum line width and spacing are 20um/20um

Frequently Asked Questions

Question points answer

Q: What information is needed to create a PCB CEGSATE: Gberber applies to the production of PCBs, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stacking structure diagram of advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application areas and other related information.

Q: What information does PCBA need to provide CEGSATE: Requires BOM report (including the brand, specification and model of the component), X and Y coordinate numbers of the PCBA component, and processing requirements: Do we need you to purchase components on behalf of you? Or are components supplied by customers? Do you need to burn software? What is the required quantity? What are monthly requirements and other details?

Question: Is my files safe? CEGSATE: Your files are very secure and we protect our intellectual property rights for our customers throughout the process. All documents provided by the customer will never be shared with any third party.

Q: What is the minimum order quantity? CESGATE: There is no minimum order quantity in POE. We are able to handle small batches and large batches flexibly.

Q: Do you have other services? CESGATE: We mainly focus on PCB+FPC production + SMT+assembly PCBA+component procurement services; in addition, we can also provide programming, testing, software burning, wiring and housing assembly services; as well as product design, product development, software development

Q: What is your testing method? How do you control the quality? CESGATE: In order to ensure the quality of PCB and FPC products, samples and small batches of products are usually tested for flying needles; the internal circuit is optically inspected by AOI and online AOI inspection, and the finished product is 100% inspected by E-SET test rack. The appearance is 100% inspected by fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), 100% X-ray fluoroscopy inspection of BGA components and first-piece inspection (FAI). According to product functional requirements, PCBA products that need to be burned through software are 100% fully tested through the finished test stand.