ABB 5SHX1960L0004 3BHL000390P0104 IGCT Module

Electrical Parameters: Operates at 24VDC, with 16 optically isolated inputs and 16 optically isolated outputs, each with a corresponding yellow LED for status indication. The output trigger current meets the gate requirements of the driven IGCT, typically around 1-3A (peak) to adapt to the IGCT's gate current requirement ($I_{GT}=100?300\text{mA}$). It has protection functions such as overcurrent and short-circuit protection, with an overcurrent detection response time of less than 500ns. Short-circuit protection based on $dI/dt$ detection can turn off the IGCT within 2μs to protect the device and system safety.

Communication Interfaces: Dual fiber optic interfaces for input to receive PWM signals and enable commands; dual fiber optic interfaces for output to feedback fault signals, and electrical interfaces to output analog status information. When communicating with higher-level controllers (such as ABB AC 800M PLC) via a fiber optic ring network, the transmission delay is less than 1μs.

Dynamic Gate Current Regulation:
The driver board (e.g., 3BHL series) continuously monitors the IGCT gate current $I_{GT}$. When an abnormal di/dt (current rise rate) is detected, it automatically adjusts the trigger pulse width to suppress transient overcurrent.
Example: In the event of a short circuit, the driver board can initiate a soft turn-off procedure within 2μs, gradually reducing the gate voltage to avoid turn-off overvoltage (dv/dt) impacts.

dI/dt and dV/dt Detection:
Built-in Rogowski coils or Hall sensors continuously monitor the main circuit's current change rate (dI/dt) and voltage change rate (dV/dt). When dI/dt exceeds the threshold (e.g., 1000A/μs), a short-circuit fault is identified, triggering an immediate hard turn-off (fastest response in 500ns), while sending fault signals to the control system via fiber optics.

Surge Current Tolerance:
The device itself supports a surge current of ≥80kA (8.3ms half-sine wave). Combined with the driver board's current limiting algorithm, it can withstand short-term overloads (such as motor starting inrushes) without damage.

Dual Built-in Temperature Sensors:
The press-fit package integrates two PT100 or thermocouple sensors to monitor the chip's central and edge temperatures, avoiding single-point failures. When either sensor detects the junction temperature approaching the threshold (e.g., 135°C), the driver board immediately issues an overheat warning; if the threshold (150°C) is exceeded, the device is forcibly turned off, and the fault status is locked.

Thermal Resistance and Cooling Linkage:
With a thermal resistance $R_{thJC}\le 0.005\text{K/W}$, a forced water cooling system (e.g., ABB 3HAC series water cooling plates) is required. The driver board real-time calculates the device's power loss ($P_{loss}=V_T\times I_T$) and links it with data from the water cooling system's flow and temperature sensors: if the water flow is below the set value (e.g., 5L/min) or the inlet water temperature exceeds 40°C, a cooling system fault alarm is triggered, and the device gradually derates.

Temperature Gradient Suppression Technology:
The high-flatness contact surface (flatness ≤2μm) of the press-fit package and the thermal uniform design of the ceramic substrate reduce the temperature gradient within the chip (ΔT≤10°C), avoiding thermal failure caused by local overheating.