- Shenzhen Hothree Technology Co., Ltd.
-
Shenzhen, Guangdong, China
- Main products: Thermal insulation material, Laird EMI, Bergquist thermal pad
Home > Products > BERGQUIST BOND-PLY > LOCTITE 3626M
LOCTITE 3626M
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Product Details
| Brand Name | LOCTITE | Place of Origin | China | |
| Model Number | 3626M |
Product Description
LOCTITE 3626M is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering.
This material is formulated to give excellent dot size and shape control when applied with a stencil using hand print or machine print process.
LOCTITE 3626M is halogen free and offers a very high thermal mechanical strength even at temperatures as high as 260oC.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.4
Density, g/cm3 1.3
Flash Point - See SDS
Yield Point, 25 °C, Pa 190-250LMS
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
Casson model @ 0.4 - 30 s -1
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 30 minutes @ 150 °C
Physical Properties
Coefficient of Thermal Expansion,
ASTM D696, K -1:
Below Tg, μm/moC 48
Above Tg, μm/moC 184
Glass Transition Temperature (Tg), °C 138
Cure Speed vs. Time, Temperature
The following graph shows the rate of conversion with time under certain temperature.
Contact Us
- Shenzhen Hothree Technology Co., Ltd.
- Contact nameCarrie Chat Now
- Phone86-755-86652465
- Addresslonggang, Shenzhen, Guangdong
Product Categories
| Bergquist hi-flow | Bergquist GAP PAD | Laird therml pad | BERGQUIST SIL PAD |
| hothree thermal pad | BERGQUIST BOND-PLY | Fujipoly | DENKA |
| PARKER LORD | Honeywell | LOCTITE |
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