BERGQUIST GAP PAD HC5.0 BERGQUIST GPHC5.0 GAP PAD TGP HC5000

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US$ 1 - 2 / Piece

10 Pieces(Min. Order)

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Product Details

Brand Name	BERGQUIST		Place of Origin	United States
Model Number	GPHC5.0

BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with

a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance

at low pressures due to a unique filler package and low-modulus resin formulation.

The enhanced material is ideal for applications requiring low stress on components

and boards during assembly. BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable

nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with

high roughness and/or topography. BERGQUIST GAP PAD HC5.0 (Thermal Silicone Pad)is offered with

natural inherent tack on both sides of the material, eliminating the need for thermally-impeding

adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC5000

is supplied with protective liners on both sides.

Shenzhen Hothree Technology Co., Ltd.: Contact nameCarrie
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