LORD SC-324 thermally conductive silicone encapsulant

CoolTherm SC-324 thermally conductive silicone  encapsulant is a two-component system designed to  

provide excellent thermal conductivity for electrical/electronic  encapsulating applications,

 while retaining desirable  properties associated with silicones.

Parker LORD SC-324 Features and Benefits: 

Low Stress – exhibits low shrinkage and stress on  components as it cures. 

Durable – composed of an addition-curing polydimethyl  siloxane polymer that will not depolymerize when heated in  confined spaces. 

Low Viscosity – maintains low viscosity for ease of  component encapsulation compared to other highly thermally  conductive materials. 

Environmentally Resistant – provides excellent thermal  shock resistance and flame retardancy. 

Application: 

Mixing – Thoroughly mix each component prior to  combining resin and hardener. 

Mix CoolTherm LORD SC-324 resin  with CoolTherm SC-324 hardener at a 1:1 ratio, by weight or  volume. 

Automatic meter/mix/dispense equipment may be  used for high volume production.

Unless a closed-chamber mechanical mixer is used, air may  be introduced into the encapsulant system either during 

 mixing or when catalyzing the mixture. Electrical properties of  the silicone encapsulant are best when air bubbles and voids  

are minimized. Therefore, in extremely high voltage or other  critical applications, vacuuming may be appropriate. 

Applying – Apply silicone encapsulant using handheld  cartridges or automatic meter/mix/dispense equipment. 

Avoid applying encapsulant to surfaces that contain cure  inhibiting ingredients, such as amines, sulfur, or tin salts.  

If bonding surface is in question, apply a test patch of  encapsulant to the surface and allow it to set for the normal  cure time. 

Curing – Allow encapsulant to cure for 24 hours at room  temperature (25°C) or for 60 minutes at 125°C. This timeat-temperature profile refers 

to the time the material should  be allowed to cure once it reaches the target temperature.  Allowance should be made for oven ramp rates, 

parts with  large thermal mass and other circumstances that may delay  material reaching the target temperature. 

Shelf Life/Storage: Shelf life of each component is six months when stored at  25°C in original, unopened container. 

LORD SC-324 encapsulant evolves minute quantities  of hydrogen gas. 

Do not repackage or store material in  unvented containers. Adequately ventilate work area to  prevent the accumulation of gas.