- Shenzhen Chaosheng Electronic Technology Co., Ltd.
-
1YrShenzhen, Guangdong, China - Main products: Oversized PCB, Any order HDIPCB, High frequency hybrid HDIPCB, Special material PCB
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Tempered Glass PCB Glass PCB
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Product Details
| Dielectric | Other, Glass PCB | Transport Package | vacuum packaging | |
| Specification | 500x1500mm | Origin | Shenzhen, Guangdong, China |
Product Description
Glass PCB
Glass PCB
Finished product size: 500x1500mm
Surface technology: OSP
Copper thickness: 35
Plate thickness: 0.35-5.0mm
Minimum aperture: 0.35mm
Features: Transparency reaches 90-95% and can withstand normal temperatures of 220-240 degrees Celsius
Usage: Large size, LED transparent screen, display frequency, LED glass screen, glass screen, film switch, etc
China Chaosheng's transparent glass circuit board technology has many advantages, and its related situations are as follows:
Technical Features
High transparency: The transparency of the glass substrate can reach over 90%, which can clearly display the internal circuit and component layout, meet special visual needs, and enhance the beauty and technological sense of the product.
Excellent electrical performance: Glass has good electrical insulation performance, which can effectively prevent leakage and short circuit, ensuring stable operation of the circuit. Meanwhile, in high-frequency applications, glass substrates can reduce signal transmission losses and ensure signal integrity.
High thermal stability: It can withstand high temperatures, adapt to various harsh working environments, and maintain good physical and chemical stability even at high temperatures, which is beneficial for the heat dissipation and long-term stable operation of electronic products.
High hardness and wear resistance: Glass material has high hardness and is not easily scratched or worn, which can effectively protect internal circuits and improve the service life of circuit boards.
Good chemical stability: It has strong resistance to most chemical substances, is not easily corroded or oxidized, and can work stably in different chemical environments.
manufacturing process
Micron level precision etching: The transparent conductive layer is very thin, usually only 50-200nm, and requires the use of yellow light process+plasma etching technology, with a line width accuracy requirement of ± 2 μ m.
Laminated process: The interlayer alignment error of transparent multilayer boards needs to be less than 10 μ m, which is higher than traditional PCB requirements. It is crucial to choose appropriate bonding materials, such as UV cured materials, during the lamination process.
Welding process: Transparent solder pads cannot be directly identified by traditional automatic optical inspection (AOI), and infrared thermal imaging positioning technology needs to be introduced with an accuracy of ± 0.1mm, or pre fixed with conductive adhesive.
Application field
Consumer electronics: can be used to manufacture transparent mobile phone screens, transparent televisions, foldable phones, etc., bringing users a brand new visual experience.
Automotive electronics: widely used in car windshields, instrument panels, and other parts. Like the HUD system of the BMW iX, which embeds metal grid circuits in the glass, the projection area expands by three times.
Medical equipment: can be used to manufacture endoscopic imaging modules, wearable monitoring patches, etc. PMMA transparent PCB can reduce the diameter of endoscopic imaging modules to 3mm.
Other fields: It can also be applied to transparent photovoltaic curtain walls in smart buildings, transparent display panels in the aerospace industry, and transparent operation interfaces in industrial control.
| Process Capability Table | ||||
| Technical ltem | MassProduct | Advanced Technology | ||
| 2015 | 2021 | 2025 | ||
| Max.Layer Count | 80 layer | 100 layer | 100 layer | |
PCB through hole board | 2～80 layer | 2～100 layer | 2～100 layer | |
Maximum size through hole 1～2 | 37〞*98.50" | 43.3〞*118.11" | 43.3〞*118.11" | |
Minimum line width and spacing | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum mechanical hole(mm) | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
Maximum size through hole 4～22 layers | 37〞*43.30" | 43.3〞*43.30" | 43.3〞*43.30" | |
Maximum size through hole 4～22 layers | 31.50 ″*59" | 31.50 ″*70.86" | 31.50 ″*70.86" | |
Maximum size through hole 4～22 layers | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum line width and spacing for multi-layer large-sized PCBs | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
| Maximum size HDI 4～36 layers | 31.50 ″*55" | 31.50 ″*55" | 31.50 ″*55" | |
| Minimum line width and line spacing of large size PCB | Through hole 12 / 12milHDI14 /14mil | Through hole 10/10 milHDI12 / 12mil | Through hole 8 / 8milHDI12 / 12mil | |
| The largest board ruler 1 → the smallest hole of 18 layers | Through hole 0.50mmHDI :0.45mm | Through hole 0.50mm HDI : 0.45mm | Through hole 0.50mmHDI : 0.45mm | |
| The layer number of FPC | 1～36layer | 1～60layer | 1～60layer | |
| Maximum size of flexible FPC | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
| Maximum size of flexible FPC with soft hard combination | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
FPC (roll to roll) maximum size | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
Maximum size of FPC single chip shipment | 19.68 ″*118.11" | 19.68 ″*196.8" | 19.68 ″*196.80" | |
| The layer number of FPC | 2～18 layer | 2～36 layer | 2～42 layer | |
Maximum size of layered board | 19.68 ″*35" | 19.68 ″*43" | 19.68 ″*43" | |
Number of through-hole layers | 2～20layer | 2～30 layer | 2～40 layer | |
Hard and soft HDI layers | 2～14 layer | 2～18 layer | 2～22 layer | |
Maximum size of soft and hard combination | 19.68 ″*43" | 19.68 ″*49" | 19.68 ″*49" | |
FPC/soft-hard combination arbitrary interconnection HDI | 4+X+4Interconnect HDI | 5+X+5Interconnect HDI | 6+X+6Interconnect HDI | |
HDIPCB layers | 4～36layer | 4～60layer | 4～80 layer | |
Anylayer HDI PCB | 4+X+4Interconnect HDI | 5+X+5、Interconnect HDI | 8+X+8、Interconnect HDI | |
HDIPCB maximum board size | 24"*52" | 43"*49" | 43"*49" | |
Number of through hole layers of high frequency board | 2～18 layer | 2～36 layer | 2～60 layer | |
| HDI layers ofhighfrequency board | 2～16 layer | 2～24 layer | 2～60layer | |
| Maximum size of high frequency board | 37 ″*43" | 43 ″*49" | 43 ″*49" | |
Number of ceramic plates | 1-2 layer | 1～4 layer | 1～6 layer | |
Ceramic plate thickness | 0.60mm-1.60mm | 0.38mm-20.0mm | 0.38mm-20.0mm | |
Maximum size of ceramic plate | 100*150mm | 150*190mm | 150*650mm | |
Minimum aperture of ceramic plate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of ceramic board | 16/16mil | 12/12mil | 10/10mil | |
Number of layers of metal copper substrate | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum line width and line spacing of metal iron substrate | 12/12mil | 4/4mil | 4/4mil | |
Number of layers of metal aluminum substrateHDI | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum size of metal substrate | 37 ″*43" | 25.59 ″*59" | 25.59 ″*59" | |
| The smallest hole of the metal substrate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of metal substrate | 8/8mil | 4/4mil | 4/4mil | |
| Transparent FR- 4 material layers | 1-2layer | 1-2layer | 1-8layer | |
| Transparent FR-4 minimum hole | 0.35mm | 0.35mm | 0.35mm | |
| Transparent FR-4 minimum line width and spacing | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| Transparent FR- 4 maximum size | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of tempered glass base layers | 1-2layer | 1-2layer | 1-2layer | |
| Minimum line width and spacing of glass | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| The smallest hole in glass | 0.35mm | 0.35mm | 0.35mm | |
| Maximum size of glass | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of layers of transparent PETmaterial | 1-2layer | 1-2layer | 1-2layer | |
| Maximum size of transparent PET | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
The company's main product types | Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、 High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc | |||
| Main material | Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc | |||
Main material categories | Halogen-free、halogenated、 high thermal conductivity, high TG135 、TG140、 TG150、 TG170、TG180、TG240、TG320 | |||
| Build-up Material | FR-4 ，TG150,TG70,TG180 | |||
| Conventional plate thickness (mm) | Min.1-2L(mm) | 0.10mm | 0.10-12.0mm | 0.10-18.0mm |
| Min.4-10L(mm) | 0.35mm | 0.35mm～10.0mm | 0.35-18.0mm | |
| Min.12L(mm) | 0.43 | 0.38～10.0mm | 0.38～18.0mm | |
| Min.16L(mm) | 0.53 | 0.45～10.0mm | 0.45～18.0mm | |
| Min.18L(mm) | 0.63 | 0.51～10.0mm | 0.51～18.0mm | |
| Min.52L(mm) | 0.8 | 0.65～10.0mm | 0.65～18.0mm | |
| MAX(mm) | 3.5 | 12.0mm | 18.0mm | |
Copper plate thickness and copper thickness | 1-2 layerCU | 700um | 875um | 875um |
| Layers 4-20 | 4-12layer | 4-16layer | 4-22layer | |
| Inner layer copper thickness（um) | 875um | 1050um | 1225um | |
Outercopperthickness | 210um | 350um | 525um | |
Thick copper finished plate thickness | 8.0mm | 12.0mm | 18.0mm | |
| IC substrate | layerHDI | 1-10layer | 1-14layer | 1-16layer |
| Line width and spacing | 50um | 25um | 15um | |
| copper thickness | 8-10um | 10-12um | 12-15um | |
| Min.CoreThickness um(mil) | 254" (10.0) | 0.15～254(10.0mm) | 0.15～254(10.0mm) | |
| Min.Build up Dielectric | 38(1.5) | 25(1.0) | 25(1.0) | |
BaseCopperWeigh t | Inner Layer | 1/4-8 OZ | 1/4-0.30mm | 1/4-0.30mm |
| Out Layer | 1/4-10 OZ | 1/4-30 OZ | 1/4-30 OZ | |
| Gold thick | 1～40u" | 1～200u" | 1～200u" | |
| Nithick | 76～127u" | 1～250u" | 1～250u" | |
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
Min. IVH、Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | |
| 125(5) | 125(5) | 125(5) | ||
| SKipvia | Yes | Yes | Yes | |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
| Technicalltem | MassProduct | Advanced Technology | ||
| Hole depth/diameter | Through Hoie | 25:01 :00 | 35:01 :00 | 40:01 :00 |
| AspctRatio | MicroVia | 0.8 :1 | 0.8 :1 | 0.8 :1 |
| copperFilling Dimple Size | 10(0.40) | 5(0.20) | 5(0.20) | |
Minimumouter line width/ spacing | Inner layer line width and spacing | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
PlatedLayerum(mil) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |
| BGAPitchmm(mil) | 0.4 | 0.4 | 0.4 | |
| PHMin.Hole rlng um(mil) | 75(3) | 62.50(2.50 | 62.50(2.50 | |
| Line Width control | <2.5mil(mil) | ±0.50 | ±0.50 | ±0.50 |
| 2.5mil≤L/W<4mil | ±0.50 | ±0.50 | ±0.50 | |
| ≤3mil(mil) | ±0.60 | ±0.60 | ±0.60 | |
| SolderMask Registration um(mil) | ±25 | ±25 | ±25 | |
| Solder masThickness | Lines Minum(mil) | 10(0.40) | 10(0.40) | 10(0.40) |
| Lines Minum(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| CopperMinum(mil) | 10(0.40) | 10(0.40) | 10(0.40) | |
| CopperMax um(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| Mln.Solder Mask opening um(mil) | 250(10) | 200(8) | 200(8) | |
Structure | Stacking layer by layer | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 42Any Layer | 46Any Layer | 60Any Layer | |
| Stacking layer by layer | N+N | N+N | N+N | |
| N+X+N | N+X+N | N+X+N | ||
| Sequenetlal Lamination | 4+(N+X+N)+4 | 5+(N+X+N)+5 | 6+(N+X+N)+6 | |
Multi-layer stepped structure | Multi- layer stacking | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 12Any Layer | 16Any Layer | 18Any Layer | |
| Multi- layer staircase | 4 steps | 6 steps | 6 steps | |
| Mechanical depth control drilling depth | 2.0mm±0.08mm | 2.0mm±0.08m | 2.0mm±0.08m | |
| Laser controlled depth drilling | 0.6mm±0.08mm | 0.8mm±0.08mm | 1.0mm±0.08mm | |
/Min.HOle/Land um(mil) | linner um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Outer um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Minimumburiedholediameter/solder pad | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
| SUBDielectricThic kness | Mln.um(mil) | 38(1.5) | 32(1.3) | 25(1.0) |
| Max.um(mil) | 125(5) | 125(5) | 125(5) | |
| SKipvia | Yes | Yes | Yes | |
| Via on hole(LaserViaon BuriePTH | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
Resin plug hole plate thickness | Min mm(mil) | 0.35 | 0.35 | 0.35 |
| Max mm(mil) | 3.2 | 3.2 | 3.2 | |
| Min mm(mil) | 125(5) | 110(4.50) | 110(4.50) | |
| Routing Depth control Accuracy um(mil) | ±50um(mil) | ±50um(mil) | ±50um(mil) | |
| Outine NC Rcuting Tolerance um(mil) | 75(3) | 75(3) | 75(3) | |
Type of surface Finishing | OSP、 Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers | |||
| EN Thickness Control(um) | >0.025-0.1um | >0.025-0.1um | >0.025-0.1um | |
| OSOSP Thickness(um) | >0.20-0.50um | >0.20-0.50um | >0.20-0.50um | |
| Ni Thickness(um) | >105? 250um | >105? 250um | >105? 250um | |
| Platinum thickness control | >0.025-5um | >0.025-5um | >0.025-5um | |
| Lead/lead- free tin spraying thickness | >105? 150um | >105? 150um | >105? 150um | |
| Electrosilver | >105? 140um | >105? 140um | >105? 140um | |
| Thickness control of sinking silver | >105? 140um | >105? 140um | >105? 140um | |
| Tin thickness control | >105? 140um | >105? 140um | >105? 140um | |
Min TestPAD | E/Tum(mil) | 75(3) | 75(3) | 75(3) |
| E/Tum(mil) | 50(2) | 50(2) | 50(2) | |
| E/Tum(mil | 25(1) | 25(1) | 25(1) | |
| E/Tum(mil) | 150（6） | 150（6） | 150（6） | |
lmpedanceContro lTolerance | ≧50ohm | ± 10% | ±8% | ±8% |
| ≦50ohm | ±50ohm | ±50ohm | ±50ohm | |
| Finished board | Plate thickness≧0.15mm | ≧ ± 10% | ≧ ± 10% | ≧ ± 10% |
| Plate thickness≧0.15mm | ≧ ±0.075% | ≧ ±0.075% | ≧ ±0.075% | |
| Warpage | ≤0.7% | ≤0.5% | ≤0.5% | |
| The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide! | ||||
| FAQ | ||||||||||||||||||
| Serial Number | Question Point | Answer | ||||||||||||||||
| Q1 | Q: What information is required to make a PCB | CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required | ||||||||||||||||
| Q2 | Q: What information does PCBA need to provide | CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information. | ||||||||||||||||
| Q3 | Question: Is my file secure? | CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party. | ||||||||||||||||
| Q4 | Q: What is the minimum order quantity? | CESGATE: We do not have a minimum order quantity for PO orders. We are able to handle small and large batches flexibly. | ||||||||||||||||
| Q5 | Q: What is your inspection method? How do you control the quality? | CESGATE: In order to ensure the quality of PCB, FPC, and PCBA products, we use flying pin testing for small batches, which is usually used for samples and small batches; The inner circuit undergoes 100% optical inspection through AOI, and we have online AOI automatic inspection for intermediate inspection. Batch finished products undergo 100% inspection through E-SET testing rack. The appearance is 100% inspected by fully automated finished product testing equipment and FQC. PCBA undergoes automatic optical inspection (AOI), 100% X-ray inspection of BGA parts, and first article inspection (FAI). PCBA products that require software burning must undergo 100% comprehensive testing on the finished product testing rack according to product functional requirements before they can be shipped. | ||||||||||||||||
| Q6 | Q: What standard should PCB be shipped according to? | WCESGATE: e accept and store according to the international IPC-6012 Level 2 standard. If there are special requirements for Level 3 standards in the quotation, we accept and store according to the international IPC-6012 Level 3 standardWe accept and store according to the international IPC-6012 Level 2 standard. If there are special requirements for Level 3 standards in the quotation, we accept and store according to the international IPC-6012 Level 3 standard | ||||||||||||||||
| Q7 | Q: May I ask how you package and ship? | 1：PCBVacuum packaging+separated white paper+moisture-proof beads+cardboard box 2：PCBVacuum packaging+white paper insulation+moisture-proof beads+tin vacuum packaging+cardboard box 3：PCBSpecial size PCB, vacuum packaging+separated white paper+moisture-proof beads+wooden frame or plastic bag packaging+separated white paper+moisture-proof beads+wooden frame 4: PCBA anti-static packaging 5: PCBA anti-static film+vacuum box packaging+shelving | ||||||||||||||||
Company Profile
Company Profile The development history of Chaosheng Group shows a typical trajectory from its establishment to growth into a leader in the printed circuit board industry. A brief overview of Chaosheng Group, its subsidiaries, and specialty products: History and Background of Chaosheng Company: Chaosheng Group was founded in 1968, originating from Japan, under the name Chaosheng Technology Japan Kawasaki Co., Ltd. In 2012, the company implemented a shareholding reform, marking a shift towards more modern and standardized management. As a Sino Japanese Hong Kong joint venture, Chaosheng Group holds an important position in the Chinese circuit board manufacturing industry. Global factory distribution Zhejiang Kunying Electronic Technology Co., Ltd. (formerly renamed after the merger of Taiwan Kunying Electronics) was established in 2001, increasing the production and technical capabilities of Chaosheng Group in the field of circuit boards. Mainly focusing on high-end precision flexible circuit boards. Shenzhen Chaosheng Electronic Technology Co., Ltd. and Shenzhen Guangrui New Electronics Co., Ltd. (formerly known as Shenzhen Mingze Electronics Co., Ltd.) were established in 1993 and 2008 respectively, further expanding Chaosheng Group's layout in the Chinese market. We mainly provide supporting processing factories for customers in product design, software development, product research and development, and SMT surface mount processing. Chaosheng Group has multiple sales networks worldwide, covering France, the United Kingdom, Germany, Japan, Europe, Switzerland, Africa, North America, Austria, Taiwan, Hong Kong and other countries and regions, showcasing its global influence. Product Features and Applications: Widely used products: communication equipment, communication instruments, optical communication, infinite terminals, new energy, intelligent systems, medical devices, detection systems, aviation, aerospace, military, drones, robots, AI technology, 5G equipment, 5G communication, optical products, LED、 The high-tech fields such as communication, automotive, and home electronics reflect the technological strength and market insight of Chaosheng Group. Main materials: halogen-free materials FR-4， Polyimide PI materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR-4 materials, heat dissipation materials, embedded materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, etc. Product structure: Metal based mixed pressure plate, embedded copper, buried resistance, buried capacitance, buried ceramic bead plate, buried ceramic, ceramic mixed pressure, multi-layer ceramic, BT board, ultra thick PCB, multi-layer aluminum substrate, high-frequency mixed pressure, impedance board, thick copper plate, thick gold plated board, high and low copper, high carbon resistance, transparent FR-4 multi-layer, glass plate Anylayer、 Single, double, multi-layer, soft and hard combination HDI, roll to roll FPC, ultra long and ultra large size boards, PCB production and product design and development, software development and SMT, PCBA and other integrated production factories The annual output value of Chaosheng Group exceeds 100 billion yuan, with the annual output value of printed circuit boards reaching over 65 billion yuan, demonstrating its strong production capacity and market competitiveness. With the continuous advancement of technology and changes in the market, Chaosheng Group needs to continue to pay attention to the dynamics of new technologies, products, and markets, strengthen research and development investment and innovation capabilities, in order to maintain its competitive advantage and industry position.
Contact Us
- Shenzhen Chaosheng Electronic Technology Co., Ltd.
- Contact nameMank.Li Chat Now
- Phone86-0755-89586738
- AddressAilian community shigangxu rd industrial zone, Shenzhen, Guangdong
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