Shenzhen Hothree Technology Co., Ltd.: Shenzhen, Guangdong, China; Main products: Thermal insulation material, Laird EMI, Bergquist thermal pad

Home > Products > BERGQUIST BOND-PLY > BERGQUIST LF3500 LIQUI FORM TLF LF3500 LIQUI-FORM 3500 Thermal Paste

BERGQUIST LF3500 LIQUI FORM TLF LF3500 LIQUI-FORM 3500 Thermal Paste

FOB Price

US$ 1 - 2 / Unit

5 Units(Min. Order)

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Product Details

BERGQUIST LIQUI FORM TLF LF3500 is a high conductivity gel thermal interface material designed for demanding

applications that require a balance between dispensability and low component stress during assembly and also in the

application.

Thermal paste of BERGQUIST LIQUI-FORM 3500 is a one-part, highly conformable gel with thixotropic properties. The material is

precured and requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low

applied stress and reliable long-term performance.

BERGQUIST LF3500 is thixotropic and has a natural tack ensuring it forms around the component and

stays in place in the application.

Thermal paste TYPICAL APPLICATIONS

● Handheld devices

● Bare die to heat spreader lid

● Filling various gaps between heat-generating devices to

heat sink and housing

● Devices requiring low assembly pressure

● High value assemblies with rework

● BGA, PGA, PPGA

Shenzhen Hothree Technology Co., Ltd.: Contact nameCarrie
Chat Now; Phone86-755-86652465; Addresslonggang, Shenzhen, Guangdong