Full-auto BGA Repair Machine Shuttle Star RW-E6250 for Mobile Phone Amd Radeon Igp 215-0674034 Bga Chipset

Full-auto BGA repair machine Shuttle Star RW-E6250 for mobile phone amd radeon igp 215-0674034 bga chipset

• PCB dimension:  W20×20~W450×W400mm                        
• PCB thickness: 0.5~4mm
• Applicable chip size: 1×1~70×70mm
• PCB locating way: outer or jig
• Working table adjustment: ±10mm forward/backward, ±10mm left/right
• Temperature control: K-type thermocouple, close cycle controlled
• Preheater: far infrared, 6000W                                            
• Top heater: hot air,1000W
• Bottom heater: hot air, 1000W
• Power supply: single-phase 220V, 50/60Hz, 6KW
• Air supply: 5~8kgf/cm²,60L/min
• Machine dimension: L850×W700×H950mm                        
• Weight: Approx.150Kgs

Description

* Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function;

* Color optical system with functions of split vision, zoom - in and micro-

    adjustment,equipped with aberration detection device; with auto focus and software

    operation function,22X optical zoom; able to rework BGA sized up to 70mm×70mm;

* Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time;

* Color LCD monitor;

* Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable;

* 6 segments of temperature up (down) and 6 segments constant temperature control, 200

    groups of temperature curve are stored; Curve analysis can be carried out on the touch

    screen and has the communication function as computers ,with software attached;

* Able to arrive at three independent temperature zones,temperature and time can be

    displayed digitally on the touch screen;able to rework CGA;

* The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;

* Suction nozzle can identify material and mounting height automatically, and can control the

   air pressure within a small range;

* Both upper and lower hot-air heating head are movable on the IR preheating area to fit for

    reworking BGA in different positions on PCB;

* Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle.

* Driven by the servo motor,the integrative hot air head can store 20 groups of different BGA

    heating points and register marks.

Details:

AUTO Mounting and AUTO Desoldering

Anti-Deformation Unit:

Company Information

• Brand Shuttle Star since 2000, it is the first one to do China-made BGA Rework Station;
• Shuttle Star is the only BGA rework machine manufacturer who can offer digital signal/digital imaging system;
• Shuttle Star can reach 0.002mm mounting precision,i think it is  world's advanced level;
• Shuttle Star have hundreds brand customers and awards;
• Shuttle Star know well the design struction and principal for bga rework. what's more, 80% China suppliers are originated from Shuttlestar;
• Shuttle Star always change ,we can do better in the future;