Hybrid integrated circuit Kovar Covers

Electronic Packaging Lids-Kovar Stepped Lids

Descriptions

FNSE offers a wide range of electronic packaging, or step lids that are used in the microelectronic and fiber optic industry. Our lids are typically made from Kovar or Alloy 42, with options of gold plating, electrolytic nickel and electroless nickel for sealing to the package.Besides precision fabrication of the lid, FNSE removes any tabs or burrs from the lid to ensure a smooth, flawless edge.

Our step lids are suitable for your fiber optic device, hybrid circuit, image sensor, laser diode package, RF microwave package, MEMS optical devices, SAW filters, X-tal oscillators, SMD package and more.

Our Services

Our variety of Kovar Stepped lids:

Chemical Etching:

Covers or step lids can be a challenge. They need to be precise and fit tightly in their mating enclosure. They also need to stay flat so they can be welded easily. Chemical etching can be the answer to these tough problems. Machining, grinding or stamping can add stress to any part, particularly when the part has a less than full thickness flange around its edge. By dissolving any unwanted material, chemical etching can produce the step lids that fit correctly and stay flat.

As with any chemically etched part the tooling can be generated quickly and inexpensively. If any adjustments need to be made to the part on future orders, adjusting the tooling is fast and easy. 

Plating & Finishing descriptions

Nickel:

Nickel plating is generally used to improve corrosion and wear resistance of the underlying base metal. Electroless Nickel ( Mil-C-26074) is good on flat or gently formed parts. Electroplated Nickel (QQ-N-290) is also available. Both types of nickel plating are not recommended on parts with sharp, formed features as the brittle plating will crack when the part is formed. Appearance of nickel can be similar to stainless steel in color, or an almost white, dull-grey color. Nickel plating is magnetic. Specify thicknesses ranging from 100u" up to 600u" and up.

Gold:

Gold plating is used in electronic parts where electrical conductivity and high corrosion resistance are required. Under Mil-G-45204 are Types I and II, grades B & C are known as hard gold . Type III, grade A is known as soft gold,(best used for wire bonding). If all you need is a gold flash, only 3 to 5 millionths of an inch of Type I, grade B is needed. Specify thickness from 10u" up to 100u".

Selective plating:

FNSE can etch your part, then selectively mask and plate onto your part. Works will most types of plating (electrolytic, electroless).

Custom Designs:

FNSE specializes in the design and manufacture of custom Lids. Our engineers are always ready to assist you in designing the most efficient and economical sensor and micro circuit packages to fit your requirements.

Full CAD/CAM Services:

With several CAD/CAM designers on staff, FNSE can take your sketch, blueprint, or Other design and turn it into a precision CAD drawing. Have your own CAD/CAM file for your part? Our experienced engineers will review your design and make sure that when it is finally sent to our computer controlled machines, your part will be produced accurately.

FNSE is a full-service metal forming and manufacturing company.

Company Information

Sanjin Electronics have 18-year experiences in OEM manufacturing Ceramics Packages; TO Metal Caps; CerDIP Lead frames and all kinds of Microelectronics Packaging Covers/Lids(Kovar Flat lids and Kovar Stepped Lids), etc. Our company qualification ensures our products with ISO9000, ISO14000 and SGS certificate to meet your stringent quality requirements. Also, we have successful cases in Russia, Germany, USA, and so on. Our value is Serve Every Client Heart and Soul!