Bachmann MPC270-128512M Communication Module

High-Speed Processing: Equipped with a high-performance 32-bit ARM Cortex-M7 processor and 128MB memory, it rapidly handles complex control algorithms and data exchange tasks, enhancing system response speed and efficiency.

Diverse Interfaces: Features multiple communication interfaces, supporting mainstream servo drive protocols like EtherCAT, CANopen, and Sercos III for seamless integration with various devices and systems.

Strong Programmability: Supports multiple programming languages (e.g., C/C++, Ladder Logic), enabling users to write custom control programs.

High Reliability: Constructed with high-quality materials and manufacturing processes, it adapts to the operating temperature range of -20°C to 60°C, meeting diverse industrial application requirements.

Easy Maintenance & Debugging: Incorporates self-diagnosis functions to detect and report faults, facilitating timely issue identification and resolution.

Good Expandability: Can be combined and expanded with other modules, allowing users to configure and upgrade systems as needed.

Processor: 32-bit ARM Cortex-M7

Clock Speed: 400MHz

Memory Capacity: 128MB

Number of Axes: Up to 32 axes

Servo Drive Interfaces: EtherCAT, CANopen, Sercos III

Operating Temperature: -20°C to 60°C

Storage Temperature: -40°C to 85°C

Dimensions: 150mm x 80mm x 35mm

Weight: Approximately 1.5kg

Communication Failure: May be caused by loose communication interfaces or incorrect parameter settings. Check interface connections, reconfirm and set communication parameters to match those of connected devices.

Module Unresponsiveness: Likely due to power issues or internal circuit failures. First, verify normal power supply and voltage within the specified range. If power is normal, internal circuit damage may require professional maintenance or module replacement.

Data Transmission Errors: May result from electromagnetic interference or memory failures. Keep the module away from strong EMI sources, check memory for abnormalities, and try restarting the module. If issues persist, replace the memory or module.

Overheating Fault: Occurs if the module operates in high temperatures or with poor heat dissipation. Ensure installation in a well-ventilated area, clean the module surface and surrounding dust, and adopt additional cooling measures if ambient temperature is too high.