SAMSUNG (Samsung Semiconductor) KLM8G1GETF-B041 Package FBGA
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Product Details
| Brand Name | SAMSUNG | Place of Origin | China | |
| Model Number | KLM8G1GETF-B041 |
Product Description
AMPAK AP6256 dealer supplies QFN44 2-in-1 WiFi module integrated IC chip
KLM8G1GETF-B041 Product Comprehensive Information
1. Product Overview
Model: KLM8G1GETF-B041, Samsung eMMC series embedded memory chip, in BGA-153 package ?15.
?Capacity?: 8GB, based on 64Gb (8GB) NAND flash memory design?37.
Core features: Supports dual voltage (1.8V/3.3V), low-power design, suitable for high-density and small-volume mobile devices?23.
2. Technical parameters
?Interface protocol?: Comply with eMMC standard, supports MMC interface clock frequency 0-200MHz, and start frequency 0-52MHz?5.
?Voltage Range?: Dual voltage compatible with ?36.
?Operating Temperature?:
?Industrial grade?: -25°C to +85°C (operating temperature), -40°C to +85°C (storage temperature)?57.
Some channels are marked as -40°C to +85°C (operating temperature)?3.
?Package size?: BGA-153 package, the specific size varies according to different sources?15.
3. Application scenarios
?Mobile devices?: thin and light terminals such as smartphones, tablets?27.
?Industrial and Consumer Electronics?: Industrial Control, Automotive Electronics, 3C Digital Products, etc.?13.
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