18 layer multi-layer electric gold finger circuit board PCB，Electric thick gold, electric gold finger circuit board PCB

18 layer multi-layer electric gold finger circuit board PCB，Electric thick gold, electric gold finger circuit board PCB

Product application: Engineering equipment server
Layers: 20layers of thick gold finger board
Board: FR-4, TG150, inner and outer copper thickness of 1OZ
Minimum aperture: 0.35mm
Through hole/(blind hole)
Minimum line width: 5mm
Minimum line width: 4mil
Minimum pore copper: 18um
Minimum laser hole mm
Impedance:+-10%
Finished copper: 1OZ
Finished product thickness 1.60mm
Shipping size: 136.0 * 115mm/1 * 1
Surface treatment: immersion gold+electroplating gold 20u"

Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.
Serial Number    Project    Manufacturing capability
1    Layers    Floors 1-80
2    Maximum size of PCB    2500*1150mm
3    Maximum size of flexible FPC    500mm*100m
4    Maximum size of PCBA    1600mm*1000mm
5    FPCBA maximum size    500mm*100m
6    PCB finished product thickness    0.15-12.0mm
7    Thickness of flexible FPC finished product    0.05-0.60mm
8    Finished copper thickness    12um-1075um
9    Minimum finished aperture of laser hole    0.075mm
10    Minimum line width and spacing    1.5mi/1.50mil
11    Minimum finished hole diameter for through-hole    0.15mm
12    Thickness stacking aspect ratio    1:35
13    By processing methods    VIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc
14    Surface Treatment    Sinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver
15    Main substrate brands    Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui/Mitsui Top), Taiyo TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hongren Hongren, Xin Yang, Nippon Steel Nippon Stee, Teflon, Yasen, Matsushita, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (USA) 3M Location, Kyocera CERADIR, Jiuhe, Jiuhao, China Porcelain, Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin, Bergs, Yalong, Taiconieta, etc
16    Solder mask color    Green, black, red, yellow, white, blue, purple, matte green, matte black, etc
17    Test service    AOI、X-Ray、 Voltage withstand test, short circuit test, soldering test, thermal shock test, functional test, high temperature and high humidity test, first piece tester, etc
18    Molding method    CNC shape, punch shape, V-CUT+forming method
19    Finished product warpage    ≤0.5%
20    Mechanical aperture tolerance    ≤0.025mm
21    Finished product warpage    ≤0.5%
22    MiNiLED Minimum PAD    0.065mm/0.065mm
23    Thermal conductivity    ≧8W
24    Highest withstand voltage    2500Pa
25    High carbon resistance value and tolerance    ≧100→15000Ω±20%
26    Impedance tolerance    ≤5→8%Ω
27    IC Carrier Board Series    Minimum line width and spacing of 20um/20um