Shenzhen Chaosheng Electronic Technology Co., Ltd.: Shenzhen, Guangdong, China; Main products: HDImulti-layer PCB, Soft hard combination flexible FPC, HDI multi-layer PCB, Oversized Circuit Board (PCB), Multi layer ultra large size PCB, HDI flexible FPC, Multi layer ultra large size circuit board PCB, Roll to roll flexible FPC, Multi layer flexible FPC, Double layer roll to roll flexible FPC, PCBA, Multi layer thick copper circuit board PCB, PCB, Ultra long size thick copper PCB, Flexible FPC，Soft hard combination flexible FPC, HDI circuit board PCB, Multi layer aluminum based PCB, Thermoelectric separation multi-layer aluminum based PCB, Thermoelectric separation copper based PCB, Thick Gold Circuit Board PCB, High frequency mixed voltage multi-layer PCB, Ultra long size thick copper PCB, HDImulti-layer PCB, Soft hard combination flexible FPC, HDImulti-layer PCB, Soft hard combination flexible , Communication server circuit board PCB, Flexible FPC，Soft hard combination flexible FPC, HDI circuit board PCB, HDI high-frequency PCB, Multi layer aluminum based PCB, Thermoelectric separation multi-layer aluminum based PCB, Thermoelectric separation copper based PCB

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Home > Products > Roll to roll flexible FPC > Multi layer flexible thin line flexible FPC, HDI flexible multi-layer FPC, multi-layer layered flexible FPC, ultra large size flexible FPC

Multi layer flexible thin line flexible FPC, HDI flexible multi-layer FPC, multi-layer layered flexible FPC, ultra large size flexible FPC

FOB Price

USD $3.96

≥10 Set

Port Shekou, China
Payment TermsT/T L/C
Delivery Detail25 days

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Product Details

Material	Polyester Film	Application	Digital Products, Computer with LCD Screen, Aviation and Aerospace
Structure	Double-Sided FPC	Brand	chaoshengpcb
Flame Retardant Properties	V0	Insulation Materials	Organic Resin
Processing Technology	Delay Pressure Foil	Combination Mode	Adhesive Flexible Plate
Base Material	Aluminum	Specification	12*126.0

Product Description

Introduction to Flexible FPC Circuit Board Factory

Product field: Handheld product series;
Layers: 2LFPC
Plate thickness 0.20mm ± 10%; Size: 30 * 10mm
Process structure: Shengyi PI, minimum hole 0.20mm, copper thickness 1OZ, line width and spacing 3/3mil
Surface treatment: Electric gold 1u"

Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.

Serial Number

Project

Manufacturing capability

Layers

Floors 1-80

Maximum size of PCB

2500*1150mm

Maximum size of flexible FPC

500mm*100m

Maximum size of PCBA

1600mm*1000mm

FPCBA maximum size

500mm*100m

PCB finished product thickness

0.15-12.0mm

Thickness of flexible FPC finished product

0.05-0.60mm

Finished copper thickness

12um-1075um

Minimum finished aperture of laser hole

0.075mm

Minimum line width and spacing

1.5mi/1.50mil

Minimum finished hole diameter for through-hole

0.15mm

Thickness stacking aspect ratio

1:35

By processing methods

VIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc

Surface Treatment

Sinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver

Main substrate brands

Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui/Mitsui Top), Taiyo TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hongren Hongren, Xin Yang, Nippon Steel Nippon Stee, Teflon, Yasen, Matsushita, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (USA) 3M Location, Kyocera CERADIR, Jiuhe, Jiuhao, China Porcelain, Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin, Bergs, Yalong, Taiconieta, etc

Solder mask color

Green, black, red, yellow, white, blue, purple, matte green, matte black, etc

Test service

AOI、X-Ray、 Voltage withstand test, short circuit test, soldering test, thermal shock test, functional test, high temperature and high humidity test, first piece tester, etc

Molding method

CNC shape, punch shape, V-CUT+forming method

Finished product warpage

≤0.5%

Mechanical aperture tolerance

≤0.025mm

Finished product warpage

≤0.5%

MiNiLED Minimum PAD

0.065mm/0.065mm

Thermal conductivity

≧8W

Highest withstand voltage

2500Pa

High carbon resistance value and tolerance

≧100→15000Ω±20%

Impedance tolerance

≤5→8%Ω

IC Carrier Board Series

Minimum line width and spacing of 20um/20um

FAQ

Question Point

Answer

Q: What information is required for PCB

CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required

Q: What information does PCBA need to provide

CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.

Question: Is my file secure?

CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.

Q: What is the minimum order quantity?

CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.

Q: Do you have any other services?

CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development

Q: What is your inspection method? How do you control the quality?

CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.

Contact Us

Shenzhen Chaosheng Electronic Technology Co., Ltd.: Contact nameMank.Li
Chat Now; Phone86-0852-69383485; AddressLonggang, Shenzhen, Guangdong

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Product Categories

soft hard combination FPC	HDI arbitrary order blind buried hole PCB	High frequency and high-speed HDIPCB	Metal copper based, aluminum based single/double multi-layer PCB
IC carrier board series multi-layer PCB	BT material single, double multi-layer HDIPCB	MiNiLED double-layer, multi-layer, HDIPCB	Roll to roll flexible FPC
PCB+PCBA	Oversized PCB

Multi layer flexible thin line flexible FPC, HDI flexible multi-layer FPC, multi-layer layered flexible FPC, ultra large size flexible FPC

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