Single component epoxy bonding adhesive

This series of one-component epoxy encapsulating adhesives is a heat-curing one-component epoxy encapsulant. It has the characteristics of stable storage, moderate viscosity, good insulation performance, high bonding performance, and easy to use compared with two-component. It is suitable for bonding and sealing of metals, coils, motors and other components.

    QLD5515 one-component epoxy coating adhesive

      5515 one-component epoxy coating adhesive is a heating and curing one-component epoxy adhesive, which is mainly used for wrapping and sealing metals, coils and other devices.

    QLD5516 one-component epoxy bonding rubber

      5516 one-component epoxy bonding adhesive is a heating and curing one-component epoxy adhesive, which is mainly used for the bonding and sealing of IC chips, circuit bench electronic components.

Performance indicators

Processing

1. Take the glue out of the refrigerator and put it at room temperature to balance with the outside world for 1~2 hours.

2. Glue dotted on the substrate, if the viscosity of the glue is high, the glue can be preheated at 40~50 °C before gluing, or it can be used without preheating.

3. Heating and curing.

4. After use, the lid should be covered in time and stored in the refrigerator at 5°C.

Notes: 

1. The validity period of this product is 3 months when stored at 5°C, and it can still be used if the viscosity is suitable after the storage period.

2. The curing test should be carried out according to the actual curing conditions and the characteristics of the processed components to ensure the best curing conditions suitable for specific products.

3. This product is non-dangerous goods, and it is stored and transported as non-dangerous goods.

4. Packing: 1kg.