High resolution VMM auto focus indentation measurement machine

High resolution VMM auto focus indentation measurement machine

Used for measuring optical lense,silicon wafer surface,coating,eletronics central control chip etc.

Non-contact roughness contour profile measurement device is widely used in product geometry and surface profile measurement, such as product coating surface profile, silicon wafer surface profile measurement, cell phone center control and precision parts, optical lenses, automotive parts and other fields.

Main parameters:

Auxiliary generation: include auxiliary points, auxiliary lines, auxiliary round roughness analysis: Ra,Rq,Rz(Ry),Rz(DIN),R3z,Rz(jis),Rp,Rv,Rt,Rsk,Rsm,Rc ,Rpm,Rku,Rdq,Roc,Mr1,Mr2,Rpk,Rvk,Rk,Rdc,A1,A2,R,Rx,AR,Rcp,Rmax,Rz-ISO

Waviness analysis:wt,wa,wp,wv,wq,wc,wku,wsk,w,wx,wz,wsm,wdc,wte,wmr,Aw,c(wmr)wmr(c),wdq

Measuring Functions:

Size: Including horizontal distance, vertical distance, linear distance, radius, diameter

Angle: contains horizontal angle, vertical angle

Auxiliary generation: Including auxiliary points, auxiliary lines, auxiliary round roughness analysis: Ra,Rq,Rz(Ry),Rz(DIN),R3z,Rz(jis),Rp,Rv,Rt,Rsk,Rsm,Rc ,Rpm,Rku,Rdq,Roc,Mr1,Mr2,Rpk,Rvk,Rk,Rdc,A1,A2,R,Rx,AR,Rcp,Rmax,Rz-ISO

Waviness analysis:wt,wa,wp,wv,wq,wc,wku,wsk,w,wx,wz,wsm,wdc,wte,wmr,Aw,c(wmr)wmr(c),wdq

Technical highlights:

● Realize the correction function of different phase position positions, the measurement result is not affected by the misalignment of the workpiece, and the position deviation caused by the tilt

● Equipped with shape treatment algorithm filter, to maximize the effect of beating caused by interference

● Ultra -high sensitivity and large -scale dynamic light sensing elements can measure different reflexives workpieces, not affected by the color of the workpiece

● Diverse reflexes, man -reflexes, interference light and bruises

Product Parameters

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