Temperature Circulate Test Machine for Body Systems

Temperature Circulate Test Machine for Body Systems

Cycle Temperature Test Machine/Scope:

Our products are widely used in scientific research, aviation,electrical , electronic, toys, plastic , metal , batteries , cell phones, optical , LED, and other parts of the various industry sectors . In the company of talent , technology and funding various types of environmental testing equipment complies with GB, GJB, IEC, MIL, DIN and other standards for scientific research , electrical , electronics, aerospace, communications, automotive, laptop computers and other enterprises.

Temperature Loop Test Instrument/Technical details:

1.Objective: accelerated stress accelerated life test test test environmental stress screening (ESS)

Test standard :

MIL-STD-202;Method107;IEC60749-25;JEDECJESD22-A104-bIEC68-2-1;MIL-STD-2164-85

2.Test method: temperature impact test temperature cycling test

3.Test environment: the environment more than the use of harsh environment limits

4.Sample : spare parts and components , solder joints (BGA, CSP) Finished

5.Sample size: small large

6.test temperature range : -40 (-55) ~ 125 (150) celsius degree , -40 (-65) ~ 125 (150) celsius degree , -40 (-0) ~ 100 celsius degree 

7.Studio Size: the box size W*H*D600*850*800cm

8.MEAS W*H*D1200*1700*1300cm

Temperature change rate:

1.bath method : more than 30 celsius degree / min ( air )

2.bath method : more than 50 celsius degree / min ( air )

3.bath method : less than 15 celsius degree / min ( sample )

4.bath method : less than 20 celsius degree / min ( air )

Cyclical Temperature Instrument/Acceleration factor:

1.100 ~ 500 times

2.accelerated test acceleration factor smaller than 10 to 20 times

3.Test result: production quality difference verify design information

Temperature Circulate Instrument/Temperature Shock Test :

1.heating / cooling rate of not less than 30 celsius degree / min . Large temperature range , and also increases the test severity changes in the rate of temperature increase .

2.difference in temperature shock test and temperature cycling test is primarily different stress load mechanism . Mainly on the temperature shock test due to creep and fatigue damage cited

Lapse , but mainly on the temperature cycle fatigue failure due to shear caused .

3.temperature shock tests allow the use of two -slot test device ; temperature cycle test using a single-slot test device . In the second slot cabinets , temperature change rate to

Greater than 50 celsius degree / min.

4.cause temperature shock : reflow, drying , reprocessing, repair and other manufacture, repair process drastic temperature changes .

5.accelerated stress test: accelerated test using accelerated testing in a real environment is more than a short time , the test sample , in order to investigate the failure mechanism .

6.accelerated test method is used to increase the stress test samples fail to promote in the short term . However, care must be taken to avoid stress failure mechanisms other causes .

Temperature cycle test .