Rogers 6006 High Frequency PCB Prototype

Place of Origin	China

Rogers 6006 High Frequency PCB Prototype?Quick Detail :1. Type : Pcb2. Material : Rogers?3. Layer : Multilayer?4. Products Size :5*275px5. Permittivity : 10.2?6. Surface finish :ENIG???Features:1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .2. Immersion gold surface finish make the pcb 's conductive performance enhancements.3. Multilayer pcb design ,the precision of the pcb improves much more better .4. Low dielectric : 2.5?dielectric conductivity much more precision .?Description :RT/duroid? 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2.?RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.RT/duroid 6006 laminates are supplied clad both sides with ? oz. to 2 oz./ft2 (8.5 to 70 μm) electrodeposited copper foil. Cladding with rolled copper foil is also available. Thick aluminum, brass, or copper plate on one side may be specified.?High Thermal Performance·?Tg of 200 (DSC), 230°C (DMA)·?Low CTE for reliability·?Lead-free Compatible & Rhos Complaint·?UV Blocking and AOI Fluorescence·?Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat??PrePreg MaterialIt?announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.Key Benefits:?·?High dielectric constant for circuit size reduction·?Low loss. Ideal for operating at X-band or below·?Tight εr and thickness control for repeatable circuit performance?Typical Applications:·?Space Saving Circuitry·?Patch Antennas·?Satellite Communications Systems·?Power Amplifiers·?Aircraft Collision Avoidance Systems·?Ground Radar Warning Systems?Production Description :ParameterValueSpeci?c gravity/density1.850 g/cm3?(3,118 lb/cu yd)Water absorption?0.125 in < 0.10%Temperature index140 °C (284 °F)Thermal conductivity, through-plane0.29 W/(m·K),[1]?0.343 W/(m·K)[2]Thermal conductivity, in-plane0.81 W/(m·K),[1]?1.059 W/(m·K)[2]Rockwell hardness110 M scaleBond strength> 1,000 kg (2,200 lb)Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)Izod impact strength - LW> 54 J/m (10 ft·lb/in)Izod impact strength - CW> 44 J/m (8 ft·lb/in)Compressive strength - flatwise> 415 MPa (60,200 psi)Dielectric breakdown (A)> 50 kVDielectric breakdown (D48/50)> 50 kVDielectric strength20 MV/mRelative permittivity (A)4.8Relative permittivity (D24/23)4.8Dissipation factor (A)0.017Dissipation factor (D24/23)0.018Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHzGlass transition temperatureCan vary, but is over 120 °CYoung's modulus - LW3.5×106?psi (24 GPa)Young's modulus - CW3.0×106?psi (21 GPa)Coefficient of thermal expansion - x-axis1.4×10?5?K?1Coefficient of thermal expansion - y-axis1.2×10?5?K?1Coefficient of thermal expansion - z-axis7.0×10?5?K?1Poisson's ratio - LW0.136Poisson's ratio - CW0.118LW sound speed3602 m/sSW sound speed3369 m/sCompetitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB .??What Information customer need to provide for quotation ?1. PCB Gerber files?,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable.?