SAN Storage 4 Layer Tg 170 PCB FR 4 Immersion Gold Lead Free 1.5oz

SAN Storage 4 Layer Tg 170 PCB FR 4 Immersion Gold Lead Free 1.5oz

PCB Data sheets

Advantages

a) High Tg 170 material. Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

b) Immersion gold. Good oxidation resistance and good heat dissipation.

c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.

d) Eligible products rate of first production: >95%

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PCB Knowledge: HASL

Hot air solder leveling is for short HASL, which is a common type of surface finish used on printed circuit boards (PCBs). We dipped the PCBs (with exposed copper surfaces) into a bath of molten solder, then remove the excess solder on PCB surface and in the holes by strong hot air(which we call it HASL machine) to get a glossy layer of coating.

One is alloy of tin and lead. The temperature of smelting furnace for Tin/Led is about 240℃. Another one is pure tin, because lead is harmful to human body, EU has forbidden using tin/lead. So the popular is pure tin or HASL Lead free. The temperature of smelting furnace for pure tin is highly at 300℃, and plus the operating environment, high temperature and high etching are great harm on PCB itself. Due to its hot air generated, HASL has low planarity. It makes this surface finish unsuitable for use with fine pitch components. It has hidden danger of board warp or twist under high thermal stress. To avoid this disadvantages, high Tg material and PP are took into consideration for some PCB user. But it also has excellent wetting durin