Mobile Terminal 6 Layer PCB Immersion Gold Fr4 Circuit Board Assembly

Mobile Terminal 6 Layer PCB Immersion Gold Fr4 Circuit Board Assembly

PCB Data sheets

Advantages

a) High Tg FR-4, Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability

b) Immerson gold, Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

d) No MOQ, low cost for small quantity prototypes and samples.

More Applications in Electronics

Hsdpa Router
Universal Ac Power Supply
Low Noise Block
Electronic Manufacturer
Wireless Transmitters

PCB Knowledge: Specifications of FR-4

When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately.

FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254 μm) to 3 inches (76 mm).

Copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2 (300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1 μm (1.34 thou), 68.2 μm (2.68 thou), and 102.3 μm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35 μm (may also be referred to as 35 μ, 35 micron, or 35 mic).

1/0 - denotes 1 oz/ft2 copper one side, with no copper on the other side.

1/1 - denotes 1 oz/ft2 copper on both sides.

H/0 or H/H - denotes 0.5 oz/ft2 copper on one or both sides, respectively.

2/0 or 2/2 - denotes 2 oz/ft2 copper on one or both sides, respectively.

Due to the development needs of