Home > Products > Blind Via PCB > Navigation System Blind Via PCB 10 Layer High Tg Fr4 Multilayer Circuit Board
Navigation System Blind Via PCB 10 Layer High Tg Fr4 Multilayer Circuit Board
- 0 Kilogram / Kilograms per Month
- T/T L/C D/P D/A
- 7 days
You May Like
-
8 Layer High Tg PCB FR4 1.6mm Immersion Gold Multilayer Circuit Board
-
HASL Lead Free FR4 Multilayer PCB Fabrication 4 Layer Tg135 1.6mm Thick
-
SAN Storage 4 Layer Tg 170 PCB FR 4 Immersion Gold Lead Free 1.5oz
-
Black Double Sided Printed Circuit Boards 2 Layer PCB for Bluetooth Receiver
-
2 Layer High Tg PCB Immersion Gold Green Solder Mask For IR Module
-
HASL 0.6 mm Double Sided PCB Assembly Services For Level Switch
Product Details
| Brand Name | Bicheng | Place of Origin | China | |
| Model Number | SCZ-19001-V4.5 |
Product Description
Certification:UL
Navigation System Blind Via PCB 10 Layer High Tg Fr4 Multilayer Circuit Board
?
PCB properties
| PCB SIZE | 129 x 131mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 10 layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP Signal |
| 4mil prepreg | |
| copper ------- 35um(1oz) GND Plane | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) SIG1 | |
| 5mil prepreg | |
| copper ------- 18um(0.5oz) SIG2 | |
| 5mil FR-4 | |
| copper ------- 35um(1oz) PWR Plane | |
| 13mil prepreg | |
| copper ------- 35um(1oz) GND Plane | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) SIG3 | |
| 5mil prepreg | |
| copper ------- 18um(0.5oz) SIG4 | |
| 5mil FR-4 | |
| copper ------- 35um(1oz) GND Plane | |
| 4mil prepreg | |
| copper ------- 35um(1oz)+plate BOT Signal | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minmum / Maximum Holes: | 0.51/2.20mm |
| Number of Different Holes: | 21 |
| Number of Drill Holes: | 732 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | Single Trace Impedance Control, L1,L3, L7,L8, L10, Track 6mil, 7.2mil, 50Ohm. Differential Pairs Impedance Control, L3, L6, Track/Space 10.5mil / 8.3mil, 6.6mil / 8.3mil , 100Ohm |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 TG170℃, er<5.4.IT180A, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz, 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold 0.05μm over 3μm Nickel (19.1% area) |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), via tented, Blind via from Top to Innerlayer 3 |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Navigation system |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
?
?
Advantages
a) High Tg FR-4 grade epoxy glass. Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
b) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d)?Eligible products rate of first production: >95%
?
?
More Applications in Electronics
Computer Power Supplies
Electronic Assembly
Led PCB
POS Cash Register
Vehicle Tracking Devices
?
?
FAST SERVICE (Prototypes)
