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Rigid 8 Layer Surface Mount SMT PCB Assembly , AutomaticOpticalInspection
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- 7 days
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Product Details
Brand Name | HUASWIN | Place of Origin | China | |
Model Number | HSPCBA1096 |
Product Description
Certification:ISO/UL/RoHS
Rigid 8 Layer Surface Mount SMT PCB Assembly , Automatic Optical Inspection
Specifications
1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products?
2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers\' requests or samples. Plastic injection processing available.?
3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.?
4. ROHS compliant and lead-free process.?
5. In-circuit, functional tests& burn-in tests, full system test?
6. High output to guarantee prompt delivery.
1 |
layer |
1-30?layer |
2 |
Material |
CEM-1,?CEM-3?FR-4,?FR-4?High?TG,?Polyimide,?Aluminum-based ?material.? |
3 |
Board?thickness |
0.2mm-6mm |
4 |
Max.finished?board?size |
800*508mm |
5 |
Min.drilled?hole?size |
0.25mm |
6 |
min.line?width |
0.075mm(3mil) |
7 |
min.line?spacing |
0.075mm(3mil) |
8 |
Surface?finish |
HAL,?HAL?Lead?free,Immersion?Gold/?Silver/Tin,?Hard?Gold,? OSP |
9 |
Copper?thickness |
0.5-4.0oz |
10 |
Solder?mask?color |
green/black/white/red/blue/yellow |
11 |
Inner?packing |
Vacuum?packing,Plastic?bag |
12 |
Outer?packing |
standard?carton?packing |
13 |
Hole?tolerance |
PTH:±0.076,NTPH:±0.05 |
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
15 |
Profiling?punching |
Routing,V-CUT,Beveling |
PCB?Assembly?services:?
SMT?Assembly?
Automatic?Pick?&?Place?
Component?Placement?as?Small?as?0201?
Fine?Pitch?QEP?-?BGA?
Automatic?Optical?Inspection?
Through-hole?Assembly?
Wave?Soldering?
Hand?Assembly?and?Soldering?
Material?Sourcing?
IC?pre-programming?/?Burning?on-line?
Function?testing?as?requested?
Aging?test?for?LED?and?Power?boards
Complete?unit?assembly?(which?including?plastics,?metal?box,?Coil,?cable?assembly?etc)?
Packing?design
Testing?Methods
AOI?Testing
Checks?for?solder?paste?
Checks?for?components?down?to?0201\"?
Checks?for?missing?components,?offset,?incorrect?parts,?polarity
X-Ray?Inspection
X-Ray?provides?high-resolution?inspection?of:?
BGAs?
Bare?boards?
In-Circuit?Testing
In-Circuit?Testing?is?commonly?used?in?conjunction?with?AOI?minimizing?functional?defects?caused?by?
component?problems.?
Power-up?Test
Advanced?Function?Test
Flash?Device?Programming
Functional?testing
Contact Us
- Huaswin Electronics Co.,Limited.
- Contact nameMs. Vicky Lee Chat Now
- Phone86-755-29077956
- Address28D, Block D, Jin Gang Hua Ting, Xi Xiang, Bao An, Binzhou, Shandong
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