Surface Mount PCB Circuit Board Assembly Lead Free Thru Hole

Surface Mount PCB Circuit Board Assembly Lead Free Thru Hole

Specifications
?

?1. PCB Assembly on SMT and DIP

?2.?PCB schematic?drawing/ layout /producing

?3.?PCBA?clone/change?board

?4.?Components sourcing and purchasing for PCBA?

?5.?Enclosure design and plastic injection molding

?6.?Testing?services.?Including:?AOI,?Fuction?Testing?,?In?Circuit?Testing, ?X-Ray?For?BGA?Testing, ? ? ? ??3D?Paste?Thickness?Test

?7. IC programing

Quotation Requirement :

?
Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM
?
?

Huaswin specialized in PCB manufacturing and and PCB Assembly

PCBA capabilities:?

Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation

Detailed?Specification?of?PCB?Manufacturing
?

?
PCB?Assembly?services:?
?
SMT?Assembly?

Automatic?Pick?&?Place?
Component?Placement?as?Small?as?0201?
Fine?Pitch?QEP?-?BGA?
Automatic?Optical?Inspection?
?
Through-hole?Assembly?

Wave?Soldering?
Hand?Assembly?and?Soldering?
Material?Sourcing?
IC?pre-programming?/?Burning?on-line?
Function?testing?as?requested?
Aging?test?for?LED?and?Power?boards
Complete?unit?assembly?(which?including?plastics,?metal?box,?Coil,?cable?assembly?etc)?
Packing?design
?
?
Conformal?coating

Both?dip-coating?and?vertical?spray?coating?is?available.?Protecting?non-conductive?dielectric?layer?that?is?
applied?onto?the?printed?circuit?board?assembly?to?protect?the?electronic?assembly?from?damage?due?to?
contamination,?salt?spray,?moisture,?fungus,?dust?and?corrosion?caused?by?harsh?or?extreme?environments.
?When?coated,?it?is?clearly?visible?as?a?clear?and?shiny?material.

Complete?box?build

Complete?\'Box?Build\'?solutions?including?materials?management?of?all?components,?electromechanical?parts,?
plastics,?casings?and?print?&?packaging?material
?

Testing?Methods

AOI?Testing
Checks?for?solder?paste?
Checks?for?components?down?to?0201\"?
Checks?for?missing?components,?offset,?incorrect?parts,?polarity
X-Ray?Inspection
X-Ray?provides?high-resolution?inspection?of:?
BGAs?
Bare?boards?

In-Circuit?Testing
In-Circuit?Testing?is?commonly?used?in?conjunction?with?AOI?minimizing?functional?defects?caused?by?
component?problems.?