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PCBA/SMT with USB Controller and 0.4mm Minimum QFP Pitch
- T/T L/C D/P D/A
- 7 days
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Product Description
Specifications:
PCB: FR4
Layers count: two
Board thickness: 1.6mm
Copper thickness: 1oz
Immersion gold
Dimensions: 79 x 106mm/1up
SMT: SMD and 78 pieces component, DIP and 19 pieces component
Applicable PCB: 50 x 50 to 700 x 460mm
Component: 0201 (minimum)
QFP pitch: 0.4mm (minimum)
IC pitch: 0.30mm (minimum)
BGA ball diameter: 0.40mm (minimum)
Ball pitch: 1.0mm
BGA dimensions: 74 x 74mm
Service include: PCB layout and BOM design or copying, component procurement, SMT, DIP, enclosure assembly, test and packing
Mounting capability: 4,000,000 chips a day
DIP: 700,000 pieces a day
Contact Us
- Cirket
- Contact nameJessie mao Chat Now
- Phone86-755-27364707
- Address, Weihai, Shandong
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