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4-layer Mobile Phone Mainboard BGA PCB with EING Surface
- T/T L/C D/P D/A
- 7 days
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Product Description
Specifications:
Base material: PTFE, PCB, FR4
Layer count: 4-layer board
Board thickness: 0.8mm
Copper thickness: 1oz
Surface finishing: ENIG
Soldermask color: green
Available specifications:
Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1,000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
SMT pitch: 30° (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI): Dimension
Electrically test: supported
RoHS Directive-compliant
Possibility of SMT device mounting: supported
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- Phone86-755-27364707
- Address, Weihai, Shandong
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