Home > Products > New product > OEM PCB Assembly with 0.3mm IC Pitch and 74 x 74mm Maximum BGA Size, Measures 183.24 x 159.92mm
OEM PCB Assembly with 0.3mm IC Pitch and 74 x 74mm Maximum BGA Size, Measures 183.24 x 159.92mm
- T/T L/C D/P D/A
- 7 days
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Product Description
Specifications:
PCB: FR4 material
Layers: 2, 1.6mm, 1/1oz, HAL
Size: 183.24 x 159.92mm
SMT: SMD, 350 pieces component
DIP, 18 pieces component
Features:
Applicable PCB: 50 x 50 to 700 x 460mm
Minimum component: 0201
Minimum QFP pitch: 0.4mm
Minimum IC pitch: 0.30mm
Minimum BGA ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum BGA size: 74 x 74mm
Service include: PCB layout and BOM design or copying, component procurement, SMT, DIP, enclosure assembly, test and packing
Mounting capability: 4,000,000 chips a day
DIP: 700,000 pieces a day
Applications: SMPS, PCI, mother board, controller, CCTV, telecommunication, DVD, MP3, GPRS, military and more
Contact Us
- Cirket
- Contact nameJessie mao Chat Now
- Phone86-755-27364707
- Address, Weihai, Shandong
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| New product | pcb |
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