The Silicon target binding welding(MAT-CN)

Specifications

Size 01: diameter <360mm thickness> 1 mm (wafer / round table / rod)

Size 02: length <300mm width <300mm thickness> 1mm rectangular / sheet / step-like (splicing)

Size 03: outer diameter <360mm inner diameter> 1mm wall degree> 1 mm length> 1 mm (pipe / ring / rotatable targets)

Size 04 :: be customized according to user needs, sample processing, to map processing

Minimum order quantity

1, large concessions

Supply capacity

the same batch, the same material, continuous and reliable supply; 100 kg / month min

Delivery time

a single sheet of material 1 week delivery, bulk material 20 days -30 days delivery(working days)

Production process

vacuum levitation melting, casting into ingots, thermo-mechanical treatment and precision machining

Applicable instruments

various models magnetron sputtering equipment, etc.

Product uses

industrial-grade coating, experiments or research level Si target, electronics, optoelectronics, military, decorative, functional film

Advantages quality

1. reliability, price

2.Vacuum melting, purification and preparation of high purity, less impurity

3.Dense, rolling, oxidation, forming plasticizers

4.relatively high density, grain uniformity axis, consistency

Product accessories

formal quotation / purchase and sales contracts / packing list / material analysis detection of single / formal invoice

Packing vacuum

packaging / vacuum neutral packing / special packaging outside reinforcement package

Mode of transport for

domestic express carrier (SF, Shen Tong, EMS, Nadu --- safe, fast and reliable)