Home > Products > Multilayer PCB Board > Aluminum Based Multilayer PCB Board with Immersion Gold, Flexible PCB Board Assembly for Industry
Aluminum Based Multilayer PCB Board with Immersion Gold, Flexible PCB Board Assembly for Industry
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Product Details
Brand Name | Fortunemount | Place of Origin | China | |
Product Description
Certification:RoHS, CE, FCC
Aluminum Based Multilayer PCB Board with Immersion Gold, Flexible PCB Board Assembly for Industry
Key Specifications/Special Features:
Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD
Layers 2-30 L Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers, Isola, Taconic, Arlon, Teflon, Aluminum Based Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm Outline Tolerance ±4mil ±0.10mm Board Thickness 8mil-236mil / 0.2mm-6.0mm Board Thickness Tolerance ±10% Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm Min. Track Width 3mil / 0.075mm Min. Track Space 3mil / 0.075mm External Cu Thickness HOZ-6OZ / 17um~210um Internal Cu Thickness HOZ-6OZ / 17um~210um Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm Hole Tolerance ±2mil / ±0.05mm Hole Position Tolerance ±2mil / ±0.05mm Laser Drilling Hole Size 4mil / 0.1mm Aspect Ration 12:1 Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc. Min Solder mask Bridge 2mil / 0.050mm Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm Impedance Control V-scoring ±10% Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin, Immersion Silver, OSP, Hard Gold( up to 100u”) UL and TS16949: 2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are providedPCB assembly:
Consumer, computer, communication, industrial, security, power, traffic control board SMD, DIP, AI OEM/ODM assembly Complete product including plastics, metal works, microchip programming and functional testing process small order, high-mixed accept turn-key service including components procurement, produce, quality check, package, logisticsWe provide total solutions including:
Product development: for single-sided and multilayer PCBA Design: layout and re-layout Tooling: plastic injection molding and metal casting Manufacturing: SMT, BGA and DIP Quality certification: ICT and FCT tests Aftersales services OEM and ODM project is acceptedEquipment in our PCBA facilities includes:
Functional, electrical and in-circuit testing equipment Optical microscopes NC data programming machines Multifunction placement machines Full-vision solder printing machines Full-vision high-sped pick-and-place machines BTU reflow machines Microfocus X-ray fluoroscopy systemContact Us
- Fortune Mount International Ltd
- Contact nameKen PAN Chat Now
- Phone86-755-33100752
- Address3rd floor,Building 2,Jianghao Technology Zone, No. 438 Jihua Road, Bantian town , Longgng District, Dezhou, Shandong
Product Categories
BGA Assembly | DIP Assembly | Electronic?PCB Assembly | Multilayer PCB Board |
PCB Board Assembly | Printed Circuit Board Assembly | SMT PCB Assembly |
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