TSOP, TSSOP, QFP, BGA Printed Circuit Board Assembly, Double Sided Electronic Circuit Board Assembly

Brand Name	Fortunemount		Place of Origin	China

Delivery Time:4weeks - 8 weeks
Certification:RoHS, CE, FCC

TSOP, TSSOP, QFP, BGA Printed Circuit Board Assembly, Double Sided Electronic Circuit Board Assembly

Key Specifications/Special Features:

Our manufacturing facilities include clean workshops and high speed advanced SMT lines Our placement precision can reach chip +0.1mm on integrated circuit parts, which means we can almost deal with all kinds of integrated circuits such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA Additionally, we can provide 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package Production of customer designed components SMD assembly and through-hole components insertion IC preprogramming Function verification and burn in testing Complete unit assembly (which including plastics, metal box, coil, cable inside and more) Environmental coating Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure Packaging design We are committed to improving our product quality constantly The products delivered from us shall be full quality checked, striving to 100% customer\'s satisfaction is our long term mission To work with a reliable EMS provider with high mixed, low volume order, contact us today

Our services for the PCB Assembly

Re-layout for shortening the board size Bare pc board fabrication SMT/BGA/DIP assembly Full component procurement or the substitute components sourcing Wire harness and cable assembly Metal parts, rubber parts and plastic parts including mold making Mechanical, case and rubber molding assembly Functional testing Repairs and inspection of the sub-finished / finished goods

Our capabilities for the PCB Assembly

Stencil Size Range	736 mm x 736 mm
Min. IC Pitch	0.30 mm
Max. PCB Size	410 mm x 360 mm
Min. PCB Thickness	0.35 mm
Min. Chip Size	0201 (0.6 mm X 0.3 mm)
Max. BGA Size	74 mm X 74 mm
BGA Ball Pitch	1.00 mm (Min) / F3.00 mm (Max)
BGA Ball Diameter	0.40 mm (Min) /F1.00 mm (Max)
QFP Lead Pitch	0.38 mm (Min) /F2.54 mm (Max)
Frequency of Stencil Cleaning	1 time / 5 ~ 10 Pieces

Our capabilities for handling the Bare PC Board fabrication

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedance Control V-scoring ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
Immersion Silver, OSP, Hard Gold( up to 100u”)

UL and TS16949: 2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided

Our manufacturing experience includes, but is not limited to: