non-toxic polyamide bond for wood

HMPA2873 is a thermoplastic hot melt polyamide resin based on dimer acids. It is primarily used for woodworking operations and assembly of porous materials. It shows good wetting/penetration of most wood surfaces, medium open time allowing for hand assembly, and reasonable strength. It is recommended for a variety of applications involving wood, fabrics, paper or other porous substrates.It is not recommended for use with difficult substrates such as PVC or PET or with metal-to-metal bonding. It is 100% solid and soluble in organic solvents.

Specifications

Properties:

1.Easy processing (e.g. Low pressure molding)

2.Chemical resistance

3.Heat resistance strength

4.Low temperature resistance

5.PVC Plasticizer resistance

6.Green strength

7.Long open time

8.Adhesion to porous substrates

 Packaging: in double layer craft paper or woven compound bag

Details: 25kg/bag, 25kg/drum, 1mt/bag, 15mt without pallet or 12mt/20'fcl with pallet

Delivery Detail: 15-25 days after receiving advanced T/T Payment

  1) Samples send to you freely
2)Delivery on time, quality according to customer request completely
3)OEM, ODM is welcome
4)Support small wholesale, retails. Any inquires will be replied within 24 hour

I-Sourcing one of hot melt polyamide leading producer in China, established in 2007, specializing in development, production and selling of hot-melt polyamide adhesives. It has been widely used in automotives, air filters, book bonding, baby diapers, textile interlining, fabric lamination, textile heat transfer printing, clothing accessories and shoes.

After more than 7 years effort and development, I-Sourcing has established advanced production lines, advanced underwater pelletizing processing. The automatic control of equipments and the continuous line production ensure the high quality and stability of our products.

non-toxic polyamide bond for wood  | for footwear toe puff | for leather goods | for fabrics | for bookbonding | for paper

non-toxic polyamide bond for wood  | for footwear toe puff | for leather goods | for fabrics | for bookbonding | for paper

non-toxic polyamide bond for wood  | for footwear toe puff | for leather goods | for fabrics | for bookbonding | for paper

non-toxic polyamide bond for wood  | for footwear toe puff | for leather goods | for fabrics | for bookbonding | for paper

non-toxic polyamide bond for wood  | for footwear toe puff | for leather goods | for fabrics | for bookbonding | for paper

non-toxic polyamide bond for wood  | for footwear toe puff | for leather goods | for fabrics | for bookbonding | for paper

non-toxic polyamide bond for wood  | for footwear toe puff | for leather goods | for fabrics | for bookbonding | for pape

 What are hot melt polyamide adhesives?

Hot melt polyamide adhesives are solid adhesives at room temperature, contain absolutely no water and solvents, and are mainly composed of thermoplastic resin. Generally speaking, hot melt coaters, known as applicators, are used to melt hot melt adhesives. Guns are used to apply these adhesives in their liquid state to the adherend, which is then crimped, cooled, and adhered. The time required to complete the adhering process is only the time required to cool and solidify the adhesive, which makes it possible to adhere objects to each other in a few seconds to a few minutes.

What can you tell me about the open time and setting time?

Hot melt adhesives melt under high temperatures. You have to apply these adhesives to an object and adhere another object to it before these adhesives cool and lose their adhesive properties. The open time is the period of time from when the adhesive is applied to the adherend to when the adhesive cools to the point that it loses its adhesive properties. The open time is normally a length of time from a few seconds to a few minutes and is determined on the basis of the usage conditions, ambient environment, and hot melt adhesive mixture. 
The setting time is the period of time until the hot melt adhesive applied to the adherend cools, solidifies, and exhibits its initial adhesive strength.