Multi-function chip replacement machine hot air rework station RW-S380II same to zm-r6200 bga rework station

• Multi-function chip replacement machine hot air rework station RW-S380II  same to zm-r6200 bga rework station
• Excellent heating material produces precise controled temperatures
• Movable heating head, able to move horizontally, easy to operate
• Touch screen interface, PLC control; real-time temperature profile display
• Powerful cross flow can cool the lower heating area rapidly
• Different hot gas nozzles, easy to replace
• Adjustable PCB positioning supports, easy and fast to install PCB
• The BGA soldering supporting frame can micro-adjusted to avoid local sinkage
• 8 segments of temperature control, profile analysis can be carried out on the touch screen
• Temperature alarming and protection function for both upper and lower heating area
• Alarming function for finishing soldering or desoldering; hand vacuum pen easy for picking up BGA 
• 

Heating system: Three independent temperature zones, (top hot air heating, under hot-air heating, and bottom IR heating),

 temperature and time can be displayed digitally on the touch screen, able to rework CGA

Vacuum removal system: The system carries vacuum pen , built-in vacuum pump, suction appropriate, easy to operate,

also can protect the pins on PCB from  being damaged

Clamping device: Clamps installing schematic diagram; the irregular PCB like laptop motherboard can be grasped flatly by the clamps

Clamping device: Specially designed with flexible mobile angle can be conveniently clamp PCB, also equipped with special laptop clamping device for convenient clamp irregular laptop circuit board

Nozzle: Different-sized nozzles for different-sized BGAs,for particular component, nozzle can be custom-made

Packaging: Standard Wooden Case with Machine fixed inside

Delivery: Delievery within 1 week after get payment

Shenzhen Shuttle Star Technology Co., Ltd. is one of the earliest professional BGA rework station manufacturers in China. Ever since founded in 2000, the product structure and performance are improved constantly according to the market demand and the product series has covered the from high-end to low-end and can provide complete solutions for the BGA reparation operation according to the special demand of customer.