Electrically conductive adhesive transfer tape Single Sided

• Standard outgassing version of Tape 9703
• Standard adhesion acrylic adhesive
• Anisotropic Z-axis electrical conductivity
• PSA tack properties
• Thermal curing not required
• Can be applied as die-cut parts or in roll form
• Easy to use in assembly operations

Cotran 9705 Electrically Conductive Adhesive Transfer Tape is a pressure sensitive adhesive (PSA) transfer tape withanisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection between substrates through the adhesive thickness (the “Z-axis”) but are spaced far enough apart for the product to be electrically insulating in the plane of the adhesive. The PSA tack properties and lack of any thermal curing make tape 9705 easy to use in assembly operations.

Tape 9705 electrically connects and mechanically bonds medium pitch flexible circuits with other flexible circuits (flex),rigid printed circuit boards (PCB) or LCD screens. Electrically conductive tape 9705 offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy. Stable electrical performance in any flexible circuit interconnection application may require mechanical reinforcement (clamping).

Tape 9705 also electrically connects and mechanically bonds EMI/RFI shield and gaskets to metal frames and enclosures.The low contact resistance and tape construction result in good EMI performance. Tape 9705 can be applied as die cut parts or in roll form and has good adhesion to common EMI/RFI substrates such as aluminum, stainless steel, and smooth gasket materials.

Application Techniques
Bonding
• To obtain maximum adhesion, the bonding surfaces must be clean and dry.
• Pressure must be applied to the bond line after assembly to wet the substrates with 3M™ Electrically ConductiveAdhesive Transfer Tape 9705 and to engage the conductive particles with the substrates to make electrical connection.Mechanical pressure (roller, metal bar) or finger pressure at 15 psi (0.10 Mpa) or greater is suggested. Heat may be applied simultaneously to improve wetting and final bond strength.
• Tape 9705 should be applied between 60°F - 158°F (15°C - 70°C). Tape application below 50°F (10°C) is not
recommended because the adhesive will be too firm to wet the surface of the substrate, resulting in low adhesion.
• Adhesion builds with time, up to 24 hours may be required to reach final adhesion values.