Magnetron sputtering coating machine

Magnetron sputtering  coating  machine

Product Name:

cylindrical magnetron sputtering coating machine.

Product Description:

cylindrical magnetron sputtering machine tool is used in the production process to be coated tool cutting edge equipment.

Parameter:

1. Vacuum chamber size: Φ600 × 600 can be installed six sample holder;
2. The samples were heated chamber temperature: room temperature -150 ℃ adjustable;
3. Sample holder rotation speed: Adjustable;
4. Gas flow controller: 0-100SCCM, 0-300 SCCM adjustable;
5. Reverse sputtering bias: 0-500V;
6. It can work height range: 400mm.
7. Ultimate vacuum: ≤8.0 × 10-5Pa;
8. Working vacuum: ≤5.0 × 10-3Pa.

Product Name:

magnetron sputtering coating machine.

Product Description:

The equipment is used to prepare a conductive film, an optical waveguide film, an optical film. Widely used in universities, research institutions. Features: magnetic sputtering coating machine is a universal machine for all kinds of monolayer film, multilayer film and a doped film system. Can coat various hard film, a metal film, an alloy, a compound, a semiconductor, a ceramic film, dielectric film and a composite film other chemical reactions can also be coated ferromagnetic material. Mainly used for laboratory preparation of organic opto-electronic devices metal electrode and dielectric layer, and a catalyst for the growth of the thin film layer prepared nanomaterials.

Parameter:

1. Ultimate vacuum pressure: 5 × 10-5Pa;
2. Target diameter (mm): Φ50 axial movement 20;
3. Target power per unit area: (W / cm2) 15 ~ 20;
4. Target Power (W): DC1000W-RF500W;
5. Heating the substrate temperature: 0 ~ 500 ℃ controllable;
6. Vacuum extraction recovery time (minutes): from the atmosphere to 5 × 10-4Pa <20;
7. Target Maximum Power (W): 600;
8. Substrate deposition rate (nm / s) (AL): 3;
9. Gas flow: 0 ~ 300SLM.