Polyimide Heat-resistant Peelable Adhesive Tape

Specifications

Heat-resistant Peelable Adhesive Tape is a product which combines Western Hemisphere's advanced adhesion controled technology with heat resistant base materials and adhesives, and is applied in various electronic components and device processes. With the wide variety of outstanding heat resistant characteristics, It can be applied to temporary fixing and masking in heating processes, and can be used for protection and transport of film components. The adhesives can be chosen from acrylic-based adhesives and other silicon-based adhesives, suitable for heating applications, to meet customer needs.

Features

• Outstanding heat resistance.
• Optimum for temporary fixing and masking in heating processes, and for protection and transport of film components.
• Suitable adjustments can be made for processed products.

Strucuture

Specifications

*Adherend: SUS plate, 2kg roller b , passes back and forth once, 5mm/sec, peeling speed 300mm/min, 180° angle

*Adherend: SUS plate, 2kg roller b, passes back and forth once, 5mm/sec, peeling speed 300mm/min, 180° angle

Applications

• Carrier: Support for thin-layer materials and protection during transport
• Temporary fixing: Temporary fixing manufacturing processes riring high-temperature
• Masking: Masking for package manufacturing processes
• Surface protection: Protection of CCD glass
• Dam: Prevents resin leakage when molding semiconductor packages and electronic components

Caution

• Please avoid skin contact, as this could cause rashes.
• Please refer to a certified disposal company for safe disposal. (Do not incinerate as this may produce toxic gas or odors that can cause nausea if inhaled.)