Perfect Air Gap Filling Effect Thermal Pads For Pc Chip And High Frequency Microprocessors

• Fill the air gap between heating devices and heat sink or metal base

• Improve the efficiency and service life of heating components

• Ultra-strong adhesion to various surface

• High thermally conductive acrylic adhesive

• Double-sided pressure-sensitive adhesive tape

• Effectively replace lubricating grease and mechanical fastening

• With good adhesion to most metal, glass, alloy and plastic materials, etc.

• Solidified under room temperature

• With good electrical insulation and weather resistance

• No preheating process is required for the product

• Excellent adhesion and sealing strength with good conductivity

• Suitable for auto-dispensing and screen printing

Compared with traditional materials, the phase change thermal interface materials can cover and fill the gap and hollow between the contact interfaces when being liquid.

1. What are your main products?

We supply thermally conductive pad, thermally silicone RTV, thermally conductive silicone pug, thermally double component silicone, thermally conductive materials, phase change thermal interface materials, thermally conductive insulators and thermal grease. Samples of thermal pads for pc chip are available, but the freights need to be paid by the buyers.

2. What about the product quality and which certificate do you have?

We have UL certificate and RoHS certificate.

3. How long does it take to deliver after order?

For small quantity, we arrange delivery within one week normally while for big quantity, we will arrange delivery as soon as possible according to actual situation and customer's requirements.

4. What about your after-sale service?

We fully guarantee our product quality and will provide free technical guidance on operations.