Epoxy Resin 170 for PCB Encapsulation – UL94 V-0 Flame Retardant

Epoxy Resin 170 (E-51 Type) – High-Performance Industrial Epoxy for Electronics, Composites & CoatingsProduct Overview

Epoxy Resin 170 (E-51 Standard Equivalent) is a premium bisphenol-A-based thermosetting resin engineered for demanding industrial applications. With its ultra-low viscosity (11,000–15,000 mPa·s at 25°C), high epoxy value (0.51–0.54 eq/100g), and exceptional thermal/chemical resistance, it is the ideal choice for electronics encapsulation, high-strength composites, and corrosion-resistant coatings.

?? Key Technical Specifications

? Key Features & Benefits1. Ultra-Low Viscosity for Precision Applications

• Superior flowability penetrates tight gaps in PCB potting and composite molds.

• Bubble-free casting for optical clarity in LED encapsulation and art resin projects.

2. Extreme Durability

• Chemical resistance to acids, alkalis, oils, and solvents (tested per ASTM D1308).

• UV stability with minimal yellowing (passes 1,000h QUV accelerated weathering).

3. High Mechanical Strength

• Tensile strength ≥65 MPa for structural bonding in aerospace/carbon fiber parts.

• Flexural strength ≥110 MPa (ASTM D790) for impact-resistant tooling.

4. Customizable Curing

• Adjustable gel time (15–90 mins) with compatible hardeners for production flexibility.