Photovoltaic cell laser scribing machine Solar panel cutting machine manufacturers
Equipment parameter:
Mode | Increase water lossless | ||
Applicable silicon wafer size | 166x166~230x230mm，thickness120~220um | Changing the size requires simple adjustment; Can customize the cut 1/3pcs | |
Capacity | ≥7200pcs/h | ||
Fragment rate | ≤0.1% | A-grade film | |
Utilization rate | ≥95% | ||
Average laser power | 50 W/300-500W | Fully automatic laser slotting | |
Laser warranty | 2000 hours | ||
Loading method | Material box loading (dual box mode, empty box rotation), each box can hold up to 500 pieces | Box size matching 166~210 full size | |
Loading inspection | Location and defect detection (chipping, missing corners, splinter, 90° flip, dirt, scratches, etc.) | NG elimination | |
Comprehensive positioning accuracy | Cutting accuracy: ≤± 0.05mm Angle deviation: ≤ 0.04° | ||
Blanking test | Detect whether there are cracks, broken edges, missing corners, size pieces, etc | ||
Blanking handling | Splitting and discharging of material boxes (A/B dual material box mode, switching back and forth) | ||
Control system | Host machine | PLC | |
screen | Touch screen | Graphical operation interface | |
Feature | Port reservation: parameter setting, fault diagnosis, alarm, product statistics, status record, etc | ||
power supply | 380V/50Hz/10A | Three-phase five-wire | |
Compressed air | 0.6~0.8MPa | Nozzle φ16 |
Complete air outlet | Nozzle φ102mm, flow rate 300L/min | |
Laser water cooler | Cooling water: 20L; Pure water, replaced regularly | Equipped with 1 set of external chiller |
Segment cooling system water | Deionized water, or pure water |
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