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DOCBOND|Low Temperature Curing Adhesive
- Qingdao
- 7 days
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Product Details
Brand Name | Low Temperature Curing Adhesive | Place of Origin | China | |
Model Number | DB291 | Classification | Hot Melt Adhesives | |
Usage | Other, High temperature waterproof seal | Main Raw Material | Acrylic |
Product Description
DB291
This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.
Contact Us
- QINGDAO DOCBOND NEW MATERIAL CO.LTD
- Contact nameKang Cheng Chat Now
- Phone86-0532-81700039
- Address628 Jiushui East Road,Laoshan District, Qingdao, Shandong
Product Categories
electronic glue | Adhesive | bipolar plate |
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