Resin Bond Diamond Cylindrical Grinding Wheel for HVOF Ceramic Coating

Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating

Description of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:

Resin bond diamond wheels are mainly used for grinding tungsten carbide and non-metal materals. 

Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.

Feature/Benefit of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating

1. Good free-cutting

2. Good Abrasion Resistance

3. Availability in a broad range of applications in both Dry and Wet Condition

4. Improved Heat Resistance(Polyimide Series)

Application of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:

1. Surface grinder,

2. PCD/PCBN tools grinding,

3. Tungsten carbide grinding,

4. Glass grinding

5. Stone grinding

Specification of Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:

Type: 1A1,1V1,1A1R,6A2,6A9,3A1,9A1,11V9,12A2,14A1 etc.

Diameters: 25mm-1000mm

Thickness:  5mm-250m

Grit: 50# -2000# 

Hole: according to the customer requirement

Concentration: 100, 125

to meet your requirements in every way, we need the following information

----- Shape and Dimension of the wheels

----- Grit size (Mesh, refer to Table#1)

----- Concentration

----- Bond(Resinoid, Vitrified, Metallic, Electroplated)

----- Quantity