Panasonic Multifunctional Transfer Unit N610095856AB POP Feeder for CSP Flux Gel

Multifunctional transfer unit N720SA000E02 can installed to P&P machines model NM-EJM3D NPM-TT NM-EJM2D NPM-W NM-EJM7D NPM-W2 NM-EJM9B NPM NM-EJM1D NPM-D NM-EJM5D NPM-D2 NM-EJM6D NPM-D3

It is a tranfer unit apply the Flux-gel on the components when we mount BGA with CSP(Chip Scale Package) technology with Panasonic pick and place machine. When we face particular components fine pitch and cannot be mounted on the solder paste but only with flux gel. Prevent the backside components from falling off during reflow soldering. Strengthen the adhesion of BGA and CSP.The reason is the following.

Underfill was originally designed for flip chip to enhance its reliability. Because the thermal expansion coefficient of flip chip made of silicon material is much lower than that of general substrate PCB material. Therefore in the thermal cycle test. Relative displacement often occurs, resulting in mechanical fatigue and solder joints falling off or breaking. This was later applied to some BGA wafers to improve their reliability when dropped and tumble.

The material of underfill usually uses epoxy, which uses the principle of capillary action to apply Epoxy to the edge of the wafer to penetrate into the bottom of the flip chip or BGA. And then heat to cure. Because it can effectively improve the mechanical strength of the solder joints and increase the service life of the wafer. At present underfill used in the circuit board design of some handheld devices. Such as mobile phones. Because handheld devices must pass the severe drop and tumble test. Many BGA solder joints are almost unbearable.