High Quality Auto WDS-1250 Motherboard Repair Equipments For Chips Replace

High Quality Auto WDS-1250 Motherboard Repair Equipments For Chips Replace

Application

1.All mobile phone ic chip repair such as iPhone serious, Samsung, Huawei, etc;
2.PC, tablet, notebook, desktop, laptop motherboard bga rework and repair;
3.Game consoles applications such as Xbox360, PS2, PS3, PS4 Wii bga rework and repair;
4.Large circuit board maintenance, such TV, LED, service;
5.Almost all PCB board ic removal and ic mount.

Parameter

Features

WDS-A1250 its designed for big size industrial control motherboard & 5G service

All operation is control by computer.Equipped HD optical alignment system,hot air+IR+gas which heating way is 3 in 1(include nitrogen or compressed air).

l. Independent ten axis interlock,ten electric motor drive control all movement.Up&down

temperature zone/PCB movement and optical alignment system X/Y movement all can

control by computer,easy operation.Machine can store more than 100temperature

profile,suit for large quantities motherboard rework,increase the work efficiency,high-level

automatic;

2. heat and mount head design 2 in 1,which can auto rotate,mount,soldering and auto

remove function;

3. Up hot air head use two channel heating system,air outlet diameter is 80mm,when

rework big size motherboard,temperature heating very fast,temperature uniformity and cooling fast(temperature can down at one time50-80degree),which can meet the requirement of the lead free chip rework process.Down temperature use infrared&hot air heating.IR directly heating on the heating area,together heating with the hot air,this can make PCB heating up very fast(speed can reach 10°C/S),the temperature can keep uniformity at same time;

4. Independent three temperature zone(upper&lower&infrared preheater zone),upper

and lower temperature zone can auto move,can automatically reach any place on the infrared preheater zone.Down temperature can be up and down movement,support PCB,using motor auto control. PCB in the fixture not move, up and down heating head can move to any chip place on the PCB.

5. Large bottom preheater zone,adopt good quality dark infrared heating panel which

import from Germany,temperature heating up fast,preheating uniformity,preheating area of 650*520 mm.When reworking large size PCB,the system with preheating advanced function.When open the machine,the infrared area will preheating the PCB firstly.Once PCB reach the setting trigger temperature,up and lower hot air start to heating.Preheat the PCB firstly,this is better to reduce the heat loss when PCB absorption of heating,solder ball can reach the melting temperature faster,avoid to change PCB shape efficiency,increase repair success rate.

6. X, Y direction of movement and the overall unique design, making the equipment space

is fully utilized to a relatively small size of equipment to achieve large area PCB rework, the maximum clamping plate size up to 1200*700mm, no rework dead ends;

7. Built-in vacuum pump, Φ-axis arbitrary rotation, high-precision stepper motor control,

automatic memory function, precision fine-tune nozzle;

8. Suction nozzle automatically identify suction and placement height, the pressure can be

controlled in the small range of 10 grams, with 0 pressure suction, placement function, for smaller chips;the suction rod with flow function,on heating process,it will cooling BGA surface,will reduce the temperature difference between BGA surface and solder ball position,can protect the chip avoid to damage by high temperature.

9. Color high-definition optical system,with color-difference resolution, auto focus,

software operating functions, 22x optical zoom, rework Maximum BGA size 120 *120mm;

IPC+PLC control,embedded IPC,touch screen operation interface. PLC control,display temperature curve immediately,show setting curve and measured curve,can analyze the measured temperature curve.

10. 10sections up(down) temperature+10sections constant temperature,can store more

than 100group temperature curve,can analysis the temperature curve on the touch screen;

different sizes Titanium alloy nozzles,easy change,can 360°rotate.

l1. 13 pcs temperature sensor, can monitor and analysis more place on the PCB.

Equipped with nitrogen inlet, use nitrogen to protect the soldering,more the rework more safety and reliable.

Company Information

WISDOMSHOW Technology is based in Shenzhen, China, We are manufacturer for 11 years, and has been the Biggest Factory in the BGA Rework field in China. All material is of high quality under inspection and control,and all BGA Station go through 2 times of test before shipment.  High Quality Assurance is our task and also what we are doing now.

1. Is it easy to operate ? I have no experience, can I also operate it well ?
Don't worry! Our BGA rework station is designed to use easily. Normally it will take you 4-6 hours to learn how to operate;If you are a technician, it will be much faster to learn. We will provide the English user manual with the rework station together and also English version opeartion tutorial video is avilable on the Internet,such as Youtube.
We also provide free training in our company.You are welcome to visit our factory to be trained here. 
2.What is the advantage of your product?
* Been in the field since 2011 and win the high reputation from our customer.
* All our products are CE approved.
* We are original factory,the price is competitive.
* Professional engineers and sales team provide the support for you
3. What is your package? Is it safe during the transport ?
All our BGA rework station are packed in wooden box with foam, sticks and band to fix inside. It is safe enough during the transport. 
4.About the warranty, how long and how to do the after sales service?
1 year warranty for spare parts, and Whole life technical support. We have professional technical team, for any question, assistant videos are also provided.