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TSSOP Package Slot Magazine
- shenzhen
- T/T
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Product Details
| Model Number | WBF40TS8-000-R0 | Size | 58.3*215*117.3 mm |
Product Description
TSSOP packaging slot magazine custom-made manufacturers 17 years of technology precipitation, with hundreds of sets of ready-made molding die processing speed and price than the peer discount 10%, precision processing processing accuracy ± 0.01mm, product flatness ≤ 0.05mm, anodized The surface of the box is smooth and burr-free, which fully meets the technical requirements of mainstream wire bonding equipment. Product Code: WBF40TS8-000-R0; Material: 6063 aluminum profile; Number of slots: 40 slots; Dimensions: 58.3*215*117.3 mm; Surface treatment: Surface sandblasting oxidation treatment; Accessories: Cartridge *1+Baffle*2 Packing: Carton packaging.
Contact Us
- Donghongxin
- Contact namewei Chat Now
- Phone86-0755-29851938
- AddressBuilding 12, Wanfeng Dayangtian Industrial Zone, Baoan District, Shenzhen, Guangdong
Product Categories
| wafer cassettes | slot magazine | semiconductor equipment | wafer frame |
| IC tube | revolving storage product |
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