BQB Certified Bluetooth module with BLE 5.0 ble module low power consumption

1.1 Pin assignment 

2. Electronic Characteristic

2.1 Absolute maximum ratings

Note: The module is not protected against overvoltage or reserved voltages. If necessary, voltage spikes
exceeding the power supply voltage specification must be limited to values within the specified
boundaries by using appropriate protection devices.

2.2 Maximum ESD ratings

2.3 Operating temperature range

2.4 Current consumption

2.5 RF performance

3. Physical Dimension 

4. Reference Schematic Design

5. Layout and Soldering Considerations

To make sure wireless performance is at its best condition, please layout the module on the carrier board as below instructions.

5.1 Carrier board under the antenna area of the module like the picture;
5.2 Keep out enough area for the antenna area;
5.3 Reflow profiles are to be selected according to standard manufacturing process;
5.4 The soldering temperature should be less than 206℃;
5.5 The module should be placed far away other low frequency and digital circuits;
5.6 The MS50 series modules contain highly sensitive electronic circuitry and are Electrostatic
Sensitive Devices (ESD). Handling the MS50 series modules without proper ESD protection
may destroy or damage them permanently.

                                                                              Recommended Layout for the Carrier Board
*PCB: It’s the mother board / carrier board.