Home > Products > AD TI > ADS54J40IRMPT Dual-Channel, 14-Bit, 1.0-GSPS Analog-to-Digital Converter (ADC)
ADS54J40IRMPT Dual-Channel, 14-Bit, 1.0-GSPS Analog-to-Digital Converter (ADC)
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Product Details
Brand Name | TI | Place of Origin | American Samoa | |
Model Number | ADS54J40IRMPT | Type | Drive IC | |
Package | DIP | D/C | 17+ |
Product Description
ADS54J40IRMPT Dual-Channel, 14-Bit, 1.0-GSPS Analog-to-Digital Converter (ADC)
ADS54J40IRMPT DescriptionThe ADS54J40 is a low-power, wide-bandwidth, 14-bit, 1.0-GSPS, dual-channel, analog-to-digital converter (ADC). Designed for high signal-to-noise ratio (SNR), the device delivers a noise floor of –158 dBFS/Hz for applications aiming for highest dynamic range over a wide instantaneous bandwidth. The device supports the JESD204B serial interface with data rates up to 10.0 Gbps, supporting two or four lanes per ADC. The buffered analog input provides uniform input impedance across a wide frequency range and minimizes sample-and-hold glitch energy. Each ADC channel optionally can be connected to a wideband digital down-converter (DDC) block. The ADS54J40 provides excellent spurious-free dynamic range (SFDR) over a large input frequency range with very low power consumption.
The JESD204B interface reduces the number of interface lines, allowing high system integration density. An internal phase-locked loop (PLL) multiplies the ADC sampling clock to derive the bit clock that is used to serialize the 14-bit data from each channel.
14-Bit Resolution, Dual-Chanel, 1-GSPS ADC
Noise Floor: –158 dBFS/Hz
Spectral Performance (fIN = 170 MHz at –1 dBFS):
SNR: 69.0 dBFS
NSD: –155.9 dBFS/Hz
SFDR: 86 dBc
SFDR: 89 dBc (Except HD2, HD3, and Interleaving Tones)
Spectral Performance (fIN = 350 MHz at –1 dBFS):
SNR: 66.3 dBFS
NSD: –153.3 dBFS/Hz
SFDR: 75 dBc
SFDR: 85 dBc (Except HD2, HD3, and Interleaving Tones)
Channel Isolation: 100 dBc at fIN = 170 MHz
Input Full-Scale: 1.9 VPP
Input Bandwidth (3 dB): 1.2 GHz
On-Chip Dither
Integrated Wideband DDC Block
JESD204B Interface with Subclass 1 Support:
2 Lanes per ADC at 10.0 Gbps
4 Lanes per ADC at 5.0 Gbps
Support for Multi-Chip Synchronization
Power Dissipation: 1.35 W/ch at 1 GSPS
VQFNP-72 Package (10 mm × 10 mm)
ADC12J2700NKE
Description
The ADC12J1600 and ADC12J2700 devices are wideband sampling and digital tuning devices. Texas Instruments’ giga-sample analog-to-digital converter (ADC) technology enables a large block of frequency spectrum to be sampled directly at RF. An integrated DDC (Digital Down Converter) provides digital filtering and down-conversion. The selected frequency block is made available on a JESD204B serial interface. Data is output as baseband 15-bit complex information for ease of downstream processing. Based on the digital down-converter (DDC) decimation and link output rate settings, this data is output on 1 to 5 lanes of the serial interface.
A DDC bypass mode allows the full rate 12-bit raw ADC data to also be output. This mode of operation requires 8 lanes of serial output.
The ADC12J1600 and ADC12J2700 devices are available in a 68-pin VQFN package. The device operates over the Industrial (–40°C ≤ TA ≤ 85°C) ambient temperature range.
ADC12J2700NKE
SMJ320C6701-SP Rad-Tolerant Class V, Floating Point Digital Signal Processor
Features
Excellent Noise and Linearity up to and beyond FIN = 3 GHz
Configurable DDC
Decimation Factors from 4 to 32 (Complex Baseband Out)
Bypass Mode for Full Nyquist Output Bandwidth
Usable Output Bandwidth of 540 MHz at
4x Decimation and 2700 MSPSUsable Output Bandwidth of 320 MHz at
4x Decimation and 1600 MSPSUsable Output Bandwidth of 67.5 MHz at
32x Decimation and 2700 MSPSUsable Output Bandwidth of 40 MHz at
32x Decimation and 1600 MSPSLow Pin-Count JESD204B Subclass 1 Interface
Automatically Optimized Output Lane Count
Embedded Low Latency Signal Range Indication
Low Power Consumption
Key Specifications:
Bypass (2700 MSPS): 1.8 W
Bypass (1600 MSPS): 1.6 W
Power Down Mode:<50 mW
Max Sampling Rate: 1600 or 2700 MSPS
Min Sampling Rate: 1000 MSPS
DDC Output Word Size: 15-Bit Complex (30 bits total)
Bypass Output Word Size: 12-Bit Offset Binary
Noise Floor: –147.3 dBFS/Hz (ADC12J2700)
Noise Floor: –145 dBFS/Hz (ADC12J1600)
IMD3: ?64 dBc (FIN = 2140 MHz ± 30 MHz at ?13 dBFS)
FPBW (–3 dB): 3.2 GHz
Peak NPR: 46 dB
Supply Voltages: 1.9 V and 1.2 V
Power Consumption
SMJ320C6701-SP Description
The SMJ320C67x DSPs are the floating-point DSP family in the SMJ320C6000 platform. The SMJ320C6701 (’C6701) device is based on the high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making this DSP an excellent choice for multichannel and multifunction applications. With performance of up to 1 giga floating-point operations per second (GFLOPS) at a clock rate of 140 MHz, the ’C6701 offers cost-effective solutions to high-performance DSP programming challenges. The ’C6701 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. This processor has 32 general-purpose registers of 32-bit word length and eight highly independent functional units. The eight functional units provide four floating-/fixed-point ALUs, two fixed-point ALUs, and two floating-/fixed-point multipliers. The ’C6701 can produce two multiply-accumulates (MACs) per cycle for a total of 334 million MACs per second (MMACS). The ’C6701 DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals.
The ’C6701 includes a large bank of on-chip memory and has a powerful and diverse set of peripherals. Program memory consists of a 64K-byte block that is user-configurable as cache or memory-mapped program space. Data memory consists of two 32K-byte blocks of RAM. The peripheral set includes two multichannel buffered serial ports (McBSPs), two general-purpose timers, a host-port interface (HPI), and a glueless external memory interface (EMIF) capable of interfacing to SDRAM or SBSRAM and asynchronous peripherals.
The ’C6701 has a complete set of development tools that includes a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.
SMJ320C6701-SP Features
Rad-Tolerant: 100-kRad (Si) TID
SEL Immune at 89MeV-cm2/mg LET Ions
QML-V Qualified, SMD 5962-98661
Highest-Performance Floating-Point Digital
Signal Processor (DSP) SMJ320C67017-ns Instruction Cycle Time
140-MHz Clock Rate
Eight 32-Bit Instructions/Cycle
Up to One GFLOPS Performance
Pin Compatible With ’C6201 Fixed-Point DSP
SMJ: QML Processing to MIL-PRF-38535
SM: Standard Processing
Operating Temperature Ranges
–55°C to 115°C
–55°C to 125°C
VelociTI Advanced Very Long Instruction
Word (VLIW) ’C67x CPU CoreFour ALUs (Floating and Fixed Point)
Two ALUs (Fixed Point)
Two Multipliers (Floating and Fixed Point)
Eight Highly Independent Functional Units:
Load-Store Architecture With 32
32-Bit General-Purpose RegistersInstruction Packing Reduces Code Size
All Instructions Conditional
Instruction Set Features
Hardware Support for IEEE Single-Precision
InstructionsHardware Support for IEEE Double-Precision
InstructionsByte Addressable (8-/16-/32-Bit Data)
32-Bit Address Range
8-Bit Overflow Protection
Saturation
Bit-Field Extract, Set, Clear
Bit Counting
Normalization
1M-Bit On-Chip SRAM
512K-Bit Internal Program/Cache
(16K 32-Bit Instructions)512K-Bit Dual-Access Internal Data
(64K Bytes)32-Bit External Memory Interface (EMIF)
Glueless Interface to Synchronous Memories:
SDRAM and SBSRAMGlueless Interface to Asynchronous Memories:
SRAM and EPROMFour-Channel Bootloading
Direct Memory Access (DMA) Controller
With Auxiliary Channel16-Bit Host-Port Interface (HPI)
Access to Entire Memory Map
Two Multichannel Buffered Serial Ports (McBSPs)
Direct Interface to T1/E1, MVIP, SCSA Framers
ST Bus Switching Compatible
Up to 256 Channels Each
AC97 Compatible
Serial Peripheral Interface (SPI)
Compatible (Motorola)Two 32-Bit General-Purpose Timers
Flexible Phase-Locked Loop (PLL) Clock Generator
IEEE Std 1149.1 (JTAG(1))
Boundary Scan Compatible429-Pin Ceramic Ball Grid Array (CBGA/GLP) and
Ceramic Land Grid Array (CLGA/ZMB) Package Types0.18-μm/5-Level Metal Process
CMOS Technology
3.3-V I/Os, 1.9 V Internal
Engineering Evaluation (/EM) Samples are Available(2)
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- Shenzhen Chips-one technology Co., Ltd
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- Phone86-0755-84829291
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