Home > Products > Indium Phosphide Wafers > Single / Double Side Polishing Indium Phosphide Wafers Polycrystalline Lump
Single / Double Side Polishing Indium Phosphide Wafers Polycrystalline Lump
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/ Set
1 Set(Min. Order)
- T/T L/C D/P D/A
- 7 days
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Product Details
| Brand Name | DXT/OEM | Place of Origin | China | |
| Model Number | two-, three- and four-inch |
Product Description
Certification:CAS / ISO9001/ SGS
DXT manufactures and sells InP single crystal wafers for the use in telecommunications and microelectronics fields: - For fiber optics network components including DWDM lasers, VCSELs, pump lasers, PIN and APD diodes, amplifiers...
- For high speed electronics circuit using HBT, HEMT for fiber optics, wireless and space communication and automotive applications.
Technology:EPICLEAN enables InPACT to produce substrates with superior epi-ready surface cleanliness which leads to purer substrate-epilayer interface by up to one order of magnitude as proven by a number of MOCVD and CAS groups.
- lowest contamination before (on the substrate epi-ready surface) and after epitaxy (substrate-epilayer interface).
- Mechanically cleaved (distinguished from natural cleave) major flat with accuracy up to 0.02°
? Indium Phosphide Single Crystal Applications:1. Fiber Optics Networks Components
2. Dense Wavelength Division Multiplexing (DWDM) Lasers
3. Vertical-Cavity Surface-Emitting Laser (VCSEL)
4. Pump Lasers
5. PIN and APD Diodes
6. Amplifiers
7. For High Speed Electronics Circuit Using HBT
8. HEMT for Fiber Optics, Wireless and Space Communication and Automotive Applications
| InP Single Chip Parameters(VGF Crystal Growth Process Technology) | ||||||
| ? | ? | ? | ? | ? | ? | |
| Item | Diameter (inch) | Type | Carrier Concentration (cm-3) | Electron Mobility (cm2/V.s) | Resistivity (Ω.m) | Dislocation Density (cm-2) |
| InP | 2 | N | ≤1×1018 | (3.5-4)×103 | ＜1×103 | |
| S-InP | 2 | N | (0.5-1)×1018 | (2-4)×103 | ＜500 | |
| 3 | (0.5-1)×1018 | (2-4)×103 | ＜1×103 | |||
| 4 | (0.5-1)×1018 | (2-4)×103 | ＜2×103 | |||
| Zn-InP | 2/3/4 | P | (0.5-1)×1018 | 50-70 | ＜1×103 | |
| Fe-InP | 2 | SI | ＞2000 | ＞0.5×107 | ＜2.5×103 | |
| 3 | ||||||
| 4 | ||||||
| Single-side and double-side polishing, epiready. Crystal orientation(100). Standard thickness for two-inch chip is 350±25μm,three-inch chip is 600±25μm and four-inch chip is 625±25μm,others depend on different processing requirements. | ||||||
Contact Us
- Shenzhen Foms Fiber Company Limited
- Contact nameMs. Shanna Chat Now
- Phone86-755-29834576
- AddressRm1483-1484, Block B, Qinghu T-park, Qingxiang Rd, Qinghu Community,Longhua New district, Xianyang, Shaanxi
Product Categories
| Fiber Optic Adapter | Fiber Optic Terminal Box | Fiber Optical Connector | Indium Phosphide Wafers |
| Optical Fiber Patch Cord | Optical Fiber Pigtail |
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