Home > Products > Thermal Interface Material > Non-Silicone Putty GEL Thermal Conductive Thermal Interface Material
Non-Silicone Putty GEL Thermal Conductive Thermal Interface Material
- T/T L/C D/P D/A
- 7 days
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Product Details
| Brand Name | GLPOLY | Place of Origin | China | |
| Model Number | XK-GN20 |
Product Description
Introduction
Syringes packaging, automated production, high temperature, non-corrosive metal, 100% thermal curing putty. XK-GN series a high performance thermal Gel , it base on TPR, Filled with a variety of high-performance ceramic powder made. It also has a high thermal conductivity, low thermal resistance, in the heat sink affixed good. Good insulation can be infinitely compression characteristics.
Features
Have enough compressibility
Non-silicone
non-curing
Resists pump-out
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
Thermal Conductivity | W/mK | 1.4 | 2 | 3 | HOT DISK |
Contact Us
- Shenzhen Goldlink Tongda Electronics Co., Ltd
- Contact nameLynn Gui Chat Now
- Phone86-755-27579310
- AddressBlock45, Baoan Dist., Tai'an, Shandong
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| New product | Thermal Interface Material |
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