High Density FR4 Multi Layer PCB Double Sided High-tg Immersion Tin

?PRODUCT’S?DETAILS

?Raw?Material

?FR-4?(Tg?180?available)

?Layer?Count

?8-Layer

?Board?Thickness

?1.6mm

?Copper?Thickness

?2.0oz

?Surface?Finish

?ENIG(Electroless?Nickel?Immersion?Gold)

?Solder?Mask

?Green

?Silkscreen

?White

?Min.?Trace?Width/Spacing

?0.075/0.075mm

?Min.?Hole?Size

?0.25mm

?Hole?Wall?Copper?Thickness

?≥20μm

?Measurement

?300×400mm

?Packaging

?Inner:?Vacuum-packed?in?soft?plastic?bales?
?Outer:?Cardboard?Cartons?with?double?straps

?Application

?Communication,automobile,cell,computer,medical?

?Advantage

?Competitive?Price,Fast?Delivery,OEM&ODM,Free?Samples,

?Special?Requirements

?Buried?And?Blind?Via,?Impedance?Control,?Via?Plug,?
?BGA?Soldering?And?Gold?Finger?Are?Acceptable

?Certification

?UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

?PRODUCTION?CAPABILITY?OF?PCB

?Process?Engineering

?Items

?Manufacturing?Capability

?Laminate

?Thickness

?0.2～3.2mm

?Production?Type

?Layer?Count

?2L-16L

?Cut?Lamination

?Max.?Working?Panel?size

?1000×1200mm

?Inner?Layer

?Internal?Core?Thickness

?0.1～2.0mm

?Internal?width/spacing

?Min:?4/4mil

?Internal?Copper?Thickness

?1.0~3.0oz

?Dimension

?Board?Thickness?Tolerance

?±10%

?Interlayer?Alignment

?±3mil

?Drilling

?Manufacture?Panel?Size

?Max:?650×560mm

?Drilling?Diameter

?≧0.25mm

?Hole?Diameter?Tolerance

?±0.05mm

?Hole?Position?Tolerance

?±0.076mm

?Min.Annular?Ring?

?0.05mm

?PTH+Panel?Plating

?Hole?Wall?copper?Thickness

?≧20um

?Uniformity

?≧90%

?Outer?Layer

?Track?Width

?Min:?0.08mm

?Track?Spacing

?Min:?0.08mm

?Pattern?Plating

?Finished?Copper?Thickness

?1oz～3oz

?EING/Flash?Gold

?Nickel?Thickness

?2.5um~5.0um

?Gold?Thickness

?0.03~0.05um

?Solder?Mask

?Thickness

?15～35um