Double Layer Immersio Tin ,OSP Green Mask DIP,SMT,BGA Printed Circuit Board

PRODUCT’S?DETAILS

Raw?Material

FR-4?(Tg?180?available)

Layer?Count

6-Layer

Board?Thickness

1.6mm

Copper?Thickness

1.0oz

Surface?Finish

ENIG(Electroless?Nickel?Immersion?Gold)

Solder?Mask

Green

Silkscreen

White

Min.?Trace?Width/Spacing

0.075/0.075mm

Min.?Hole?Size

0.25mm

Hole?Wall?Copper?Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner:?Vacuum-packed?in?soft?plastic?bales?
Outer:?Cardboard?Cartons?with?double?straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive?Price,Fast?Delivery,OEM&ODM,Free?Samples,

Special?Requirements

Buried?And?Blind?Via,?Impedance?Control,?Via?Plug,?
BGA?Soldering?And?Gold?Finger?Are?Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION?CAPABILITY?OF?PCB

?
PROCESS?Engineer

ITEMS?Item

?????????
??????????PRODUCTION?CAPABILITY?Manufacturing?

Capability

Laminate

Type

FR-1,FR-5,FR-4?High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,

TEFLON

Thickness

0.2～3.2mm

Production?Type

????Layer?Count

2L-16L

Surface?Treatment

?HAL,Gold?Plating,Immersion?Gold,OSP,Immersion?

Silver,Immersion?Tin,Lead?Free?HAL

?Cut?Lamination

Max.?Working?Panel?size

?1000×1200mm

?Inner?Layer

?Internal?Core?Thickness

0.1～2.0mm

?Internal?width/spacing

Min:?4/4mil

?Internal?Copper?Thickness

1.0~3.0oz

?Dimension

Board?Thickness?Tolerance

±10%

?Interlayer?Alignment

±3mil

Drilling

?Manufacture?Panel?Size

Max:?650×560mm

?Drilling?Diameter

≧0.25mm

?Hole?Diameter?Tolerance

±0.05mm

?Hole?Position?Tolerance

±0.076mm

?Min.Annular?Ring?

0.05mm

PTH+Panel?Plating

?Hole?Wall?copper?Thickness

≧20um

?Uniformity

≧90%

?Outer?Layer

?Track?Width

Min:?0.08mm

Track?Spacing

Min:?0.08mm

?Pattern?Plating

?Finished?Copper?Thickness